Operational Amplifier, 1 Func, 75uV Offset-Max, BIPolar, CDIP8, HERMETIC SEALED, CERDIP-8
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.003 µA |
| 标称共模抑制比 | 126 dB |
| 最大输入失调电压 | 75 µV |
| JESD-30 代码 | R-GDIP-T8 |
| JESD-609代码 | e0 |
| 负供电电压上限 | -22 V |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 240 |
| 座面最大高度 | 5.08 mm |
| 标称压摆率 | 0.3 V/us |
| 供电电压上限 | 22 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 标称均一增益带宽 | 600 kHz |
| 宽度 | 7.62 mm |
| OP07CZ | OP07CJ | OP07Z | OP07Z/883 | OP07DJ | OP07EJ | OP07EZ | |
|---|---|---|---|---|---|---|---|
| 描述 | Operational Amplifier, 1 Func, 75uV Offset-Max, BIPolar, CDIP8, HERMETIC SEALED, CERDIP-8 | Operational Amplifier, 1 Func, 75uV Offset-Max, BIPolar, MBCY8, TO-99, 8 PIN | Operational Amplifier, 1 Func, 200uV Offset-Max, BIPolar, CDIP8, HERMETIC SEALED, CERDIP-8 | Operational Amplifier, 1 Func, 200uV Offset-Max, BIPolar, CDIP8, HERMETIC SEALED, CERDIP-8 | Operational Amplifier, 1 Func, 75uV Offset-Max, BIPolar, MBCY8, TO-99, 8 PIN | Operational Amplifier, 1 Func, 75uV Offset-Max, BIPolar, MBCY8, TO-99, 8 PIN | Operational Amplifier, 1 Func, 75uV Offset-Max, BIPolar, CDIP8, HERMETIC SEALED, CERDIP-8 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | TO-99 | DIP | DIP | TO-99 | TO-99 | DIP |
| 包装说明 | DIP, | , | DIP, | DIP, | , | , | DIP, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.003 µA | 0.003 µA | 0.006 µA | 0.006 µA | 0.003 µA | 0.003 µA | 0.003 µA |
| 标称共模抑制比 | 126 dB | 126 dB | 123 dB | 123 dB | 126 dB | 126 dB | 126 dB |
| 最大输入失调电压 | 75 µV | 75 µV | 200 µV | 200 µV | 75 µV | 75 µV | 75 µV |
| JESD-30 代码 | R-GDIP-T8 | O-MBCY-W8 | R-GDIP-T8 | R-GDIP-T8 | O-MBCY-W8 | O-MBCY-W8 | R-GDIP-T8 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C | -25 °C | -25 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | METAL | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | METAL | METAL | CERAMIC, GLASS-SEALED |
| 封装形状 | RECTANGULAR | ROUND | RECTANGULAR | RECTANGULAR | ROUND | ROUND | RECTANGULAR |
| 封装形式 | IN-LINE | CYLINDRICAL | IN-LINE | IN-LINE | CYLINDRICAL | CYLINDRICAL | IN-LINE |
| 峰值回流温度（摄氏度） | 240 | NOT SPECIFIED | 240 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 标称压摆率 | 0.3 V/us | 0.3 V/us | 0.3 V/us | 0.3 V/us | 0.3 V/us | 0.3 V/us | 0.3 V/us |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | OTHER | OTHER |
| 端子形式 | THROUGH-HOLE | WIRE | THROUGH-HOLE | THROUGH-HOLE | WIRE | WIRE | THROUGH-HOLE |
| 端子位置 | DUAL | BOTTOM | DUAL | DUAL | BOTTOM | BOTTOM | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 标称均一增益带宽 | 600 kHz | 600 kHz | 600 kHz | 600 kHz | 600 kHz | 600 kHz | 600 kHz |
| 厂商名称 | Rochester Electronics | - | - | - | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | e0 |
| 负供电电压上限 | -22 V | -22 V | -22 V | - | -22 V | -22 V | -22 V |
| 封装代码 | DIP | - | DIP | DIP | - | - | DIP |
| 座面最大高度 | 5.08 mm | - | 5.08 mm | 5.08 mm | - | - | 5.08 mm |
| 供电电压上限 | 22 V | 22 V | 22 V | - | 22 V | 22 V | 22 V |
| 端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | - | - | 2.54 mm |
| 宽度 | 7.62 mm | - | 7.62 mm | 7.62 mm | - | - | 7.62 mm |
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