Hebei I.T. (Shanghai) Co., Ltd.
LED SPECIFICATION
Part No./型号：3751PG2D-SB
3.9
3.1
Features/特征：
High bright output/高亮度输出
Low power consumption/½功耗
High reliability and long life/
可靠性高、寿½长
1±0.1
1.5±0.5
CATHODE
1.1±0.1
9.8±0.5
6.3
3.1
Single color/单色
Descriptions/描述：
Dice material/芯片材质：GaN
Emitting Color/发光颜色：
Super Bright Green/
高亮度绿色
Device Outline/产品外½：
3.9×3.1mm Oval Type / 3.9×3.1mm
椭圆½
Lens Type
胶½颜色：
Green Diffused /
绿色散射
25.4Min
0.5±0.1
2.54±0.1
NOTE/备注:
1. All dimensions are millimeters/单½：mm.
2. Tolerance is +/-0.25mm unless otherwise noted/
没有标注的公差均为±0.25mm.
Directivity/指向特性：
DIRECTIVITY
1.0
0°
Ta=25° C X
IF=20mA
Y
30°
X
Y
Relative Luminous
0.5
60°
0
90°
60°
30°
0°
0.5
90°
1.0
Radiation Angle
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0.8Max
Hebei I.T. (Shanghai) Co., Ltd.
LED SPECIFICATION
Part No./型号：3751PG2D-SB
Absolute maximum ratings/极限参数（Ta = 25℃）
Parameter
参数
Reverse Voltage
反向电压
Forward Current
正向工½电流
Power Dissipation
损耗功率
Pulse Current
正向峰值电流
Operating Temperature
工½温度范围
Storage Temperature
储存温度范围
Parameter
参数
Forward Voltage
正向电压
Reverse Current
反向电流
Dominate Wavelength
主波长
Peak Wavelength
峰值波长
Spectral Line half-width
半波长½度
Luminous Intensity
发光强度
Viewing Angle
指向角度
Symbol
符号
V
R
I
F
P
d
I
peak
T
opr
T
str
Test Condition
测试条件
I
R
= 30μA
----
----
Duty=0.1mS，1kHz
----
----
Values
数值
Min.
Max.
5
----
----
----
-30
-40
--
25
90
100
+85
+100
Unit
单½
V
mA
mW
mA
℃
℃
Electrical and optical characteristics/光电参数（Ta = 25℃）
Symbol
符号
V
F
I
R
λ
d
λ
p
Δ
λ
I
V
2θ
1/2
Test Condition
测试条件
I
F
=20mA
V
R
=5V
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
Values
数值
Min.
Typ.
Max.
----
----
----
----
----
----
----
3.2
----
528
525
35
1200
85/40
3.6
30
----
----
----
----
----
Unit
单½
V
μA
nm
nm
nm
mcd
deg.
Luminous Intensity Bins/亮度等级分档（Ta = 25℃）
Bin
Min
Max
T
1100
1520
P
1520
2130
Unit:mcd
Dominate Wavelength Bins/波长等级分档（Ta = 25℃）
Bin
Min
Max
G11
521
524
G12
524
527
G13
527
530
Unit:nm
Forward Current Bins/电压等级分档（Ta = 25℃）
Bin
Min
Max
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Unit:V
V8
3.0
3.2
V9
3.2
3.4
V10
3.4
3.6
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Hebei I.T. (Shanghai) Co., Ltd.
LED SPECIFICATION
Part No./型号：3751PG2D-SB
Typical electrical/optical characteristic curves/光电特性曲线：
Fig.1
正向电流
Vs.
正向电压
50
40
30
20
10
0
2.4
Luminous Intensity
Relative Value at IF=20mA
2.8 3.2 3.6
4.0
Forward Voltage(V)
4.4
Forward Current(mA)
2.5
2.0
1.5
1.0
0.5
0
0
40
10
20
30
IF-Forward Current (mA)
50
Fig.2
相对亮度
Vs.
正向电流
Fig.3
正向电流
Vs.
环境温度
40
30
20
10
0
0
20
40
60
80
100
Relative Luminous Intensity
50
Forward Current(mA)
2.5
2.0
1.5
1.0
0.5
Fig.4
相对亮度
Vs.
环境温度
0
-40
Ambient Temperature T
A (
℃
)
-20
0
20
40
60
Ambient Temperature T
A (
℃
)
80 90
Fig.5
相对亮度
Vs.
波长
Relative Luminous Intensity
100
75
50
25
0
400
450
500
550
600
650
700
Wavelength
λ
(nm)
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Hebei I.T. (Shanghai) Co., Ltd.
LED SPECIFICATION
Part No./型号：3751PG2D-SB
Lead Forming/成½
1. Any lead forming or bending must be done before soldering.
支架成½必须在焊接前完成。
2. When forming leads, there must be a minimum of 2mm clearance between the base of the LED lens
and the lead bend.
必需离胶½
2
毫米才½折弯支架。
3. Avoid bending the leads at the same point more than once.
避免在管脚同一½½两次或多次弯。
4. During assembly onto PCB, the lead pitch of the LED must match the pitch of the mounting holes
on the PCB during component placement.
支架成½需保证引脚和间距与线路板上一致。
Soldering Condition/焊接条件
Careful attention should be paid during soldering. When soldering, leave more then 2mm from solder
joint to case, and soldering beyond the base of the tie bar is recommended.
焊接时请特别注意，焊接点要离LED封装½底部2mm以上。
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly
when soldering.
在
LED
处于高温，特别是在焊接时，请避免对支架½压。
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Hebei I.T. (Shanghai) Co., Ltd.
LED SPECIFICATION
Part No./型号：3751PG2D-SB
Recommended soldering conditions/推荐焊接条件:
Hand Soldering
手工焊接
Temp.at tip of iron 300℃Max.(30WMax.)
电烙铁温度
最高温度300℃
（功率
不超过30瓦）
Soldering time
3 sec Max.
焊接时间
时间不超过3秒
Distance
2mm Min.(From
焊接½½
solder joint to case)
大于2毫米
（从焊点到
胶½）
DIP Soldering
浸焊
Preheat temp. 100℃ Max. (60 sec Max.)
预热温度
最高温度100℃（不超过60
秒）
Bath temp.
260℃ Max
浸焊温度
最高260℃.
Bath time.
3 sec Max.
浸焊时间
不超过3秒
Distance
浸焊½½
2mm Min
大于2毫米.
Cleaning/清洗
1. Do not clean LEDs with water, Alcohol are recommended solvents for cleaning. When using other
solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not.
不要用水清洗，推荐½用酒精清洗，½½用其他溶剂清洗时应事先确认该溶剂是否溶解树脂。
2. LEDs may be damaged by ultrasonic-washed. Before cleaning, a pre-test should be done to confirm
whether any damage to the LEDs will occur.
LED有可½在超声波清洗过程中被破坏。为了保证安全，在清洗前，请先确认。
Storage/保存
1. Environmental temperature: -40℃---100
℃
, Recommended: -20℃---50
℃
环境温度：-40℃---100℃，推荐½用-20℃---50℃；
2. Environmental humidity: 30%---70%, Recommended: 40%---60%
环境湿度：30%---70%，推荐½用40%---60%；
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