Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
ESD112-B1-02ELS E6327
MA001190846
PG-TSSLP-2-4
Material Group
non noble metal
noble metal
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
noble metal
noble metal
noble metal
< 10%
Substances
tin
gold
silicon
nickel
gold
carbon black
epoxy resin
silicondioxide
gold
palladium
gold
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7440-02-0
7440-57-5
1333-86-4
-
60676-86-0
7440-57-5
7440-05-3
7440-57-5
Issued
Weight*
Weight
[mg]
0.001
0.003
0.020
0.108
0.003
0.000
0.010
0.060
0.004
0.000
0.000
Average
Mass
[%]
0.33
1.30
9.62
51.88
1.21
0.17
4.91
28.79
1.77
0.01
0.01
17. June 2015
0.21 mg
Sum
[%]
Average
Mass
[ppm]
3345
12981
11.25
51.88
1.21
96186
518718
12117
1694
49118
33.87
1.77
287940
17699
77
0.02
125
202
1000000
338752
17699
112512
518718
12117
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
