Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSC010N04LSI
MA000974064
PG-TDSON-8-17
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
iron
phosphorus
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
1.517
0.038
0.011
37.762
0.044
0.086
6.079
36.646
1.470
0.166
0.053
0.042
2.010
0.003
0.013
0.269
10.909
0.007
0.026
0.529
21.482
Average
Mass
[%]
1.27
0.03
0.01
31.70
0.04
0.07
5.10
30.75
1.23
0.14
0.04
0.04
1.69
0.00
0.01
0.23
9.15
0.01
0.02
0.44
18.03
2. June 2015
119.16 mg
Sum
[%]
1.27
Average
Mass
[ppm]
12733
317
95
31.74
0.04
316892
373
719
51015
35.92
1.23
0.14
307530
12334
1389
442
353
1.77
16872
28
113
2255
9.39
91547
55
222
4440
18.50
180276
184993
1000000
93943
17667
359264
12334
1389
317304
373
Sum
[ppm]
12733
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
*deviation
< 10%
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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