Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSG0811ND
MA001288508
PG-TISON-8-4
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
1.270
0.011
0.043
0.862
34.984
0.010
0.093
4.800
41.708
1.180
0.087
0.048
0.038
1.822
0.008
0.031
0.619
25.123
Average
Mass
[%]
1.13
0.01
0.04
0.76
31.03
0.01
0.08
4.26
36.98
1.05
0.08
0.04
0.03
1.62
0.01
0.03
0.55
22.29
13. April 2015
112.74 mg
Sum
[%]
1.13
Average
Mass
[ppm]
11269
96
382
7643
31.84
0.01
310322
85
827
42576
41.32
1.05
0.08
369960
10465
768
423
338
1.69
16163
69
274
5488
22.88
222852
228683
1000000
16924
413363
10465
768
318443
85
Sum
[ppm]
11269
wire
encapsulation
leadfinish
plating
solder
heat sink CLIP
*deviation
< 10%
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
