Standard SRAM, 256KX1, 45ns, CMOS, PDSO24, 0.300 INCH, SOJ-24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Hitachi (Renesas ) |
零件包装代码 | SOJ |
包装说明 | SOJ, SOJ24,.34 |
针数 | 24 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 45 ns |
其他特性 | TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP |
I/O 类型 | SEPARATE |
JESD-30 代码 | R-PDSO-J24 |
JESD-609代码 | e0 |
长度 | 15.63 mm |
内存密度 | 262144 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 1 |
功能数量 | 1 |
端子数量 | 24 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 256KX1 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOJ |
封装等效代码 | SOJ24,.34 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 3.76 mm |
最大待机电流 | 0.0001 A |
最小待机电流 | 2 V |
最大压摆率 | 0.1 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
HM6207HLJP-45 | HM6207HJP-45 | HM6207HLP-25 | HM6207HP-25 | HM6207HJP-35 | HM6207HLJP-25 | |
---|---|---|---|---|---|---|
描述 | Standard SRAM, 256KX1, 45ns, CMOS, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 256KX1, 45ns, CMOS, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 256KX1, 25ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 256KX1, 25ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 256KX1, 35ns, CMOS, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 256KX1, 25ns, CMOS, PDSO24, 0.300 INCH, SOJ-24 |
厂商名称 | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
零件包装代码 | SOJ | SOJ | DIP | DIP | SOJ | SOJ |
包装说明 | SOJ, SOJ24,.34 | SOJ, SOJ24,.34 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOJ, SOJ24,.34 | SOJ, SOJ24,.34 |
针数 | 24 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 45 ns | 45 ns | 25 ns | 25 ns | 35 ns | 25 ns |
其他特性 | TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP | TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP | TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP | TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP | TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP | TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP |
I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
JESD-30 代码 | R-PDSO-J24 | R-PDSO-J24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-J24 | R-PDSO-J24 |
长度 | 15.63 mm | 15.63 mm | 29.88 mm | 29.88 mm | 15.63 mm | 15.63 mm |
内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 | 24 | 24 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOJ | SOJ | DIP | DIP | SOJ | SOJ |
封装等效代码 | SOJ24,.34 | SOJ24,.34 | DIP24,.3 | DIP24,.3 | SOJ24,.34 | SOJ24,.34 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.76 mm | 3.76 mm | 5.08 mm | 5.08 mm | 3.76 mm | 3.76 mm |
最大待机电流 | 0.0001 A | 0.002 A | 0.0001 A | 0.002 A | 0.002 A | 0.0001 A |
最小待机电流 | 2 V | 4.5 V | 2 V | 4.5 V | 4.5 V | 2 V |
最大压摆率 | 0.1 mA | 0.1 mA | 0.12 mA | 0.12 mA | 0.1 mA | 0.12 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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