ZBT SRAM, 1MX18, 2.6ns, CMOS, PQFP100, LQFP-100
参数名称 | 属性值 |
厂商名称 | Hitachi (Renesas ) |
零件包装代码 | QFP |
包装说明 | LQFP, |
针数 | 100 |
Reach Compliance Code | unknown |
ECCN代码 | 3A991.B.2.A |
最长访问时间 | 2.6 ns |
其他特性 | PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
JESD-30 代码 | R-PQFP-G100 |
长度 | 20 mm |
内存密度 | 18874368 bit |
内存集成电路类型 | ZBT SRAM |
内存宽度 | 18 |
功能数量 | 1 |
端子数量 | 100 |
字数 | 1048576 words |
字数代码 | 1000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1MX18 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LQFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大供电电压 (Vsup) | 2.625 V |
最小供电电压 (Vsup) | 2.375 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | QUAD |
宽度 | 14 mm |
HM66WP18100FP-40 | HM66WP18100BP-60 | HM66WP36512FP-40 | HM66WP18100BP-40 | HM66WP36512FP-60 | HM66WP36512BP-60 | HM66WP18100FP-60 | |
---|---|---|---|---|---|---|---|
描述 | ZBT SRAM, 1MX18, 2.6ns, CMOS, PQFP100, LQFP-100 | ZBT SRAM, 1MX18, 3.5ns, CMOS, PBGA119, BGA-119 | ZBT SRAM, 512KX36, 2.6ns, CMOS, PQFP100, LQFP-100 | ZBT SRAM, 1MX18, 2.6ns, CMOS, PBGA119, BGA-119 | ZBT SRAM, 512KX36, 3.5ns, CMOS, PQFP100, LQFP-100 | ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119, BGA-119 | ZBT SRAM, 1MX18, 3.5ns, CMOS, PQFP100, LQFP-100 |
零件包装代码 | QFP | BGA | QFP | BGA | QFP | BGA | QFP |
包装说明 | LQFP, | BGA, | LQFP, | BGA, | LQFP, | BGA, | LQFP, |
针数 | 100 | 119 | 100 | 119 | 100 | 119 | 100 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 2.6 ns | 3.5 ns | 2.6 ns | 2.6 ns | 3.5 ns | 3.5 ns | 3.5 ns |
其他特性 | PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY | PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY | PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY | PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY | PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY | PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY | PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY |
JESD-30 代码 | R-PQFP-G100 | R-PBGA-B119 | R-PQFP-G100 | R-PBGA-B119 | R-PQFP-G100 | R-PBGA-B119 | R-PQFP-G100 |
长度 | 20 mm | 22 mm | 20 mm | 22 mm | 20 mm | 22 mm | 20 mm |
内存密度 | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit |
内存集成电路类型 | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM |
内存宽度 | 18 | 18 | 36 | 18 | 36 | 36 | 18 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 100 | 119 | 100 | 119 | 100 | 119 | 100 |
字数 | 1048576 words | 1048576 words | 524288 words | 1048576 words | 524288 words | 524288 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 512000 | 1000000 | 512000 | 512000 | 1000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 1MX18 | 1MX18 | 512KX36 | 1MX18 | 512KX36 | 512KX36 | 1MX18 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LQFP | BGA | LQFP | BGA | LQFP | BGA | LQFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE | GRID ARRAY | FLATPACK, LOW PROFILE | GRID ARRAY | FLATPACK, LOW PROFILE | GRID ARRAY | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 2.35 mm | 1.6 mm | 2.35 mm | 1.6 mm | 2.35 mm | 1.6 mm |
最大供电电压 (Vsup) | 2.625 V | 2.625 V | 2.625 V | 2.625 V | 2.625 V | 2.625 V | 2.625 V |
最小供电电压 (Vsup) | 2.375 V | 2.375 V | 2.375 V | 2.375 V | 2.375 V | 2.375 V | 2.375 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | BALL | GULL WING | BALL | GULL WING | BALL | GULL WING |
端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm |
端子位置 | QUAD | BOTTOM | QUAD | BOTTOM | QUAD | BOTTOM | QUAD |
宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
厂商名称 | Hitachi (Renesas ) | Hitachi (Renesas ) | - | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
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