IC,ENCODER,HC-CMOS,LLCC,20PIN,CERAMIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | QCCN, LCC20,.35SQ |
Reach Compliance Code | not_compliant |
JESD-30 代码 | S-XQCC-N20 |
逻辑集成电路类型 | ENCODER |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 2/6 V |
认证状态 | Not Qualified |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
SN54HC148FH | SN74HC148NP3 | SN74HC148N3 | SN74HC147NP3 | SN74HC147J4 | SN74HC147JP4 | SN74HC147N1 | SN74HC147NP1 | |
---|---|---|---|---|---|---|---|---|
描述 | IC,ENCODER,HC-CMOS,LLCC,20PIN,CERAMIC | IC,ENCODER,HC-CMOS,DIP,16PIN,PLASTIC | IC,ENCODER,HC-CMOS,DIP,16PIN,PLASTIC | IC,ENCODER,HC-CMOS,DIP,16PIN,PLASTIC | IC,ENCODER,HC-CMOS,DIP,16PIN,CERAMIC | IC,ENCODER,HC-CMOS,DIP,16PIN,CERAMIC | IC,ENCODER,HC-CMOS,DIP,16PIN,PLASTIC | IC,ENCODER,HC-CMOS,DIP,16PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
JESD-30 代码 | S-XQCC-N20 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 |
逻辑集成电路类型 | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER |
端子数量 | 20 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCN | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | LCC20,.35SQ | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
表面贴装 | YES | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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