Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BGA 713N7 E6327
MA001067824
PG-TSNP-7-1
Material Group
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
zinc
tin
chromium
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-66-6
7440-31-5
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.114
0.004
0.005
0.006
2.136
0.042
0.006
0.183
1.075
0.111
0.104
0.013
0.052
Average
Mass
[%]
2.97
0.11
0.14
0.17
55.42
1.10
0.16
4.76
27.90
2.89
2.69
0.34
1.35
29. August 2013
3.85 mg
Sum
[%]
2.97
Average
Mass
[ppm]
29710
1117
1396
1675
55.84
1.10
554220
10960
1641
47587
32.82
2.89
2.69
278957
28926
26924
3378
1.69
13509
16887
1000000
328185
28926
26924
558408
10960
Sum
[ppm]
29710
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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