Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
bumps
leadframe
encapsulation
BGA 725L6 E6327
MA000997840
PG-TSLP-6-2
Material Group
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
noble metal
noble metal
noble metal
non noble metal
< 10%
Substances
silicon
copper
nickel
carbon black
epoxy resin
silicondioxide
gold
silver
silver
tin
CAS#
if applicable
7440-21-3
7440-50-8
7440-02-0
1333-86-4
-
60676-86-0
7440-57-5
7440-22-4
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
0.214
0.033
0.173
0.002
0.048
0.279
0.009
0.015
0.000
0.007
Average
Mass
[%]
27.44
4.27
22.20
0.21
6.09
35.70
1.19
1.94
0.02
0.94
29. August 2013
0.78 mg
Sum
[%]
27.44
4.27
22.20
Average
Mass
[ppm]
274386
42714
222000
2100
60910
42.00
1.19
1.94
357060
11862
19371
220
0.96
9377
9597
1000000
420070
11862
19371
Sum
[ppm]
274386
42714
222000
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com