Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
XMC4500-F144K1024 AC
MA001332560
PG-LQFP-144-24
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
magnesium
silicon
nickel
copper
gold
palladium
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
7440-05-3
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
36.527
0.450
1.949
8.994
288.415
0.002
0.049
2.185
3.071
119.751
900.691
12.469
1.526
1.735
6.150
Average
Mass
[%]
2.64
0.03
0.14
0.65
20.84
0.00
0.00
0.16
0.22
8.65
65.09
0.90
0.11
0.13
0.44
20. November 2015
1383.96 mg
Sum
[%]
2.64
Average
Mass
[ppm]
26393
325
1408
6499
21.66
208397
2
36
0.16
1579
2219
86527
73.96
0.90
0.11
650805
9010
1103
1253
0.57
4444
5697
1000000
739551
9010
1103
1617
216629
Sum
[ppm]
26393
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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