Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4266G
MA000741350
PG-SOT223-4-23
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
1.089
0.010
0.052
0.156
51.895
0.131
0.459
0.573
1.147
10.436
44.727
1.464
0.815
0.083
0.393
Average
Mass
[%]
0.96
0.01
0.05
0.14
45.74
0.12
0.40
0.51
1.01
9.20
39.43
1.29
0.72
0.07
0.35
28. August 2013
113.43 mg
Sum
[%]
0.96
Average
Mass
[ppm]
9604
92
459
1378
45.94
0.12
457501
1155
4044
5055
10111
92006
50.55
1.29
0.72
394312
12906
7182
734
0.42
3461
4195
1000000
505528
12906
7182
459430
1155
Sum
[ppm]
9604
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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