Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4274GS V25
MA000741326
PG-SOT223-4-21
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
1.163
0.010
0.051
0.152
50.489
0.117
0.461
0.577
1.154
10.497
44.988
1.464
0.513
0.071
0.333
Average
Mass
[%]
1.04
0.01
0.05
0.14
45.06
0.10
0.41
0.51
1.03
9.37
40.15
1.31
0.46
0.06
0.30
28. August 2013
112.04 mg
Sum
[%]
1.04
Average
Mass
[ppm]
10376
90
453
1358
45.26
0.10
450637
1048
4118
5148
10296
93692
51.47
1.31
0.46
401539
13067
4579
630
0.36
2969
3599
1000000
514793
13067
4579
452538
1048
Sum
[ppm]
10376
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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