IC,FILTER,LOW PASS,CMOS,DIP,16PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | DIP |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| 有源滤波器类型 | SWITCHED CAPACITOR FILTER |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e0 |
| 标称负供电电压 (Vsup) | -5 V |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 阶次 | 7TH |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | +-5 V |
| 认证状态 | Not Qualified |
| 响应 | LOWPASS |
| 最大供电电流 (Isup) | 5 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 传递特性 | ELLIPTIC |
| TSG8511IP | TSG8511CP | TSG8511IC | TSG8511MC | TSG8511VC | TSG8511VP | |
|---|---|---|---|---|---|---|
| 描述 | IC,FILTER,LOW PASS,CMOS,DIP,16PIN,PLASTIC | IC,FILTER,LOW PASS,CMOS,DIP,16PIN,PLASTIC | IC,FILTER,LOW PASS,CMOS,DIP,16PIN,CERAMIC | IC,FILTER,LOW PASS,CMOS,DIP,16PIN,CERAMIC | IC,FILTER,LOW PASS,CMOS,DIP,16PIN,CERAMIC | IC,FILTER,LOW PASS,CMOS,DIP,16PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 有源滤波器类型 | SWITCHED CAPACITOR FILTER | SWITCHED CAPACITOR FILTER | SWITCHED CAPACITOR FILTER | SWITCHED CAPACITOR FILTER | SWITCHED CAPACITOR FILTER | SWITCHED CAPACITOR FILTER |
| JESD-30 代码 | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 标称负供电电压 (Vsup) | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -25 °C | - | -25 °C | -55 °C | -40 °C | -40 °C |
| 阶次 | 7TH | 7TH | 7TH | 7TH | 7TH | 7TH |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 响应 | LOWPASS | LOWPASS | LOWPASS | LOWPASS | LOWPASS | LOWPASS |
| 最大供电电流 (Isup) | 5 mA | 5 mA | 5 mA | 5 mA | 5 mA | 5 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | COMMERCIAL | OTHER | MILITARY | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 传递特性 | ELLIPTIC | ELLIPTIC | ELLIPTIC | ELLIPTIC | ELLIPTIC | ELLIPTIC |
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