Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88
| 参数名称 | 属性值 |
| 厂商名称 | Numonyx ( Micron ) |
| 零件包装代码 | BGA |
| 包装说明 | TFBGA, |
| 针数 | 88 |
| Reach Compliance Code | unknown |
| 其他特性 | PSRAM IS ORGANIZED AS 1M X 16 |
| JESD-30 代码 | R-PBGA-B88 |
| JESD-609代码 | e1 |
| 长度 | 10 mm |
| 内存密度 | 67108864 bit |
| 内存集成电路类型 | MEMORY CIRCUIT |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 88 |
| 字数 | 4194304 words |
| 字数代码 | 4000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -30 °C |
| 组织 | 4MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 1.95 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | TIN SILVER COPPER |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8 mm |
| M36W0R6040B0ZAQE | M36W0R6040T0ZAQE | M36W0R6040T0ZAQT | M36W0R6040T0ZAQ | M36W0R6040T0ZAQF | M36W0R6040B0ZAQT | |
|---|---|---|---|---|---|---|
| 描述 | Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 | Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 | Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 | Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 | Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 | Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 |
| 厂商名称 | Numonyx ( Micron ) | Numonyx ( Micron ) | Numonyx ( Micron ) | Numonyx ( Micron ) | Numonyx ( Micron ) | Numonyx ( Micron ) |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | TFBGA, | TFBGA, | TFBGA, | TFBGA, | TFBGA, | TFBGA, |
| 针数 | 88 | 88 | 88 | 88 | 88 | 88 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | PSRAM IS ORGANIZED AS 1M X 16 | PSRAM IS ORGANIZED AS 1M X 16 | PSRAM IS ORGANIZED AS 1M X 16 | PSRAM IS ORGANIZED AS 1M X 16 | PSRAM IS ORGANIZED AS 1M X 16 | PSRAM IS ORGANIZED AS 1M X 16 |
| JESD-30 代码 | R-PBGA-B88 | R-PBGA-B88 | R-PBGA-B88 | R-PBGA-B88 | R-PBGA-B88 | R-PBGA-B88 |
| JESD-609代码 | e1 | e1 | e0 | e0 | e1 | e0 |
| 长度 | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm |
| 内存密度 | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit |
| 内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 88 | 88 | 88 | 88 | 88 | 88 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C |
| 组织 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | TIN SILVER COPPER | TIN SILVER COPPER | TIN LEAD | TIN LEAD | TIN SILVER COPPER | TIN LEAD |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm |
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