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Datasheet> 器件分类 > 存储> 存储> M36W0R6040T0ZAQF

M36W0R6040T0ZAQF: 产品描述Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88; 产品类别存储存储; 文件大小347KB，共18页; 制造商Numonyx ( Micron ); 官网地址https://www.micron.com

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M36W0R6040T0ZAQF概述

Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88

M36W0R6040T0ZAQF规格参数

参数名称	属性值
厂商名称	Numonyx ( Micron )
零件包装代码	BGA
包装说明	TFBGA,
针数	88
Reach Compliance Code	unknown
其他特性	PSRAM IS ORGANIZED AS 1M X 16
JESD-30 代码	R-PBGA-B88
JESD-609代码	e1
长度	10 mm
内存密度	67108864 bit
内存集成电路类型	MEMORY CIRCUIT
内存宽度	16
功能数量	1
端子数量	88
字数	4194304 words
字数代码	4000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-30 °C
组织	4MX16
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260
认证状态	Not Qualified
座面最大高度	1.2 mm
最大供电电压 (Vsup)	1.95 V
最小供电电压 (Vsup)	1.7 V
表面贴装	YES
技术	CMOS
温度等级	OTHER
端子面层	TIN SILVER COPPER
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	8 mm

M36W0R6040T0ZAQF相似产品对比

	M36W0R6040T0ZAQF	M36W0R6040T0ZAQE	M36W0R6040T0ZAQT	M36W0R6040T0ZAQ	M36W0R6040B0ZAQE	M36W0R6040B0ZAQT
描述	Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88	Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88	Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88	Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88	Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88	Memory Circuit, 4MX16, CMOS, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88
厂商名称	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )	Numonyx ( Micron )
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,
针数	88	88	88	88	88	88
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
其他特性	PSRAM IS ORGANIZED AS 1M X 16	PSRAM IS ORGANIZED AS 1M X 16	PSRAM IS ORGANIZED AS 1M X 16	PSRAM IS ORGANIZED AS 1M X 16	PSRAM IS ORGANIZED AS 1M X 16	PSRAM IS ORGANIZED AS 1M X 16
JESD-30 代码	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88
JESD-609代码	e1	e1	e0	e0	e1	e0
长度	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm
内存密度	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit
内存集成电路类型	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
内存宽度	16	16	16	16	16	16
功能数量	1	1	1	1	1	1
端子数量	88	88	88	88	88	88
字数	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words
字数代码	4000000	4000000	4000000	4000000	4000000	4000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C
组织	4MX16	4MX16	4MX16	4MX16	4MX16	4MX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260	260	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
最大供电电压 (Vsup)	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V
最小供电电压 (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
端子面层	TIN SILVER COPPER	TIN SILVER COPPER	TIN LEAD	TIN LEAD	TIN SILVER COPPER	TIN LEAD
端子形式	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm

M36W0R6040T0ZAQF

M36W0R6040T0ZAQF概述

M36W0R6040T0ZAQF规格参数

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