Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, TSOP2-32
参数名称 | 属性值 |
厂商名称 | Micross |
包装说明 | TSOP2, |
Reach Compliance Code | compliant |
最长访问时间 | 10 ns |
JESD-30 代码 | R-PDSO-G32 |
长度 | 20.95 mm |
内存密度 | 1048576 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 32 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 128KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 10.16 mm |
AS5LC1008DGCR-10L/IT | AS5LC1008DGC-15L/XT | AS5LC1008DGCR-20L/IT | AS5LC1008DGCR-12L/IT | AS5LC1008DGCR-15L/IT | AS5LC1008DGC-12L/XT | AS5LC1008DGC-20L/XT | |
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描述 | Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, TSOP2-32 | Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, TSOP2-32 | Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, TSOP2-32 | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, TSOP2-32 | Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, TSOP2-32 | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, TSOP2-32 | Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, TSOP2-32 |
厂商名称 | Micross | Micross | Micross | Micross | Micross | Micross | Micross |
包装说明 | TSOP2, | TSOP2, | TSOP2, | TSOP2, | TSOP2, | TSOP2, | TSOP2, |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
最长访问时间 | 10 ns | 15 ns | 20 ns | 12 ns | 15 ns | 12 ns | 20 ns |
JESD-30 代码 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
长度 | 20.95 mm | 20.95 mm | 20.95 mm | 20.95 mm | 20.95 mm | 20.95 mm | 20.95 mm |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C |
组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
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