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Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Application

CBR Series, C0G Dielectric, Ultra High Q, Low ESR,

6.3VDC-250VDC (RF & Microwave)

Preliminary

Overview

KEMET’s CBR series surface mount multilayer ceramic capacitors

(MLCCs) in C0G dielectric feature a robust and exceptionally

stable base metal electrode dielectric system that provides

excellent low loss performance (High Q). These devices offer

extremely low ESR and high self-resonance characteristics, and

are well suited for resonant circuit applications or those where

Q and stability of capacitance characteristics are required. CRF

series capacitors exhibits no change in capacitance with respect

to time and voltage and boasts a negligible change in capacitance

with reference to ambient temperature. Capacitance change is

limited to ±30ppm/ºC from -55°C to +125°C.

CBR series devices are are suitable for many circuit applications

including RF power amplifiers, mixers, oscillators, low noise

amplifiers, filter networks, antenna tuning, timing circuits, delay

lines and MRI imaging coils.

Benefits

• -55°C to +125°C operating temperature range

• Ultra High Q

• Base metal electrode (BME) dielectric system

• Pb-Free and RoHS compliant

• 0201, 0402, 0603 and 0805 case sizes (inches)

• DC voltage ratings of 6.3V, 10V, 25V, 50V, 100V and 250V

• Capacitance offerings ranging from 0.1pF up to 100pF

• Available capacitance tolerances of ±0.05pF, ±0.1pF, ±0.25pF,

±0.5pF, ±1%, ±2%, ±5% and ±10%

• No piezoelectric noise

• Low ESR

• High thermal stability

• No capacitance change with respect to applied rated DC voltage

• Negligible capacitance change with respect to temperature

• No capacitance decay with time

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination finish allowing for

excellent solderability

Applications

Typical applications include critical timing, tuning, bypass,

coupling, feedback, filtering, impedance matching and DC

blocking.

Field applications include wireless and cellular base stations,

wireless LAN, subscriber based wireless services, wireless

broadcast equipment, satellite communications, RF PA modules,

filters, VCOs, PAs, matching networks, RF modules, satellite

communications and medical electronics.

Ordering Information

CBR

Series

CBR

02

C

330

Capacitance

Code (pF)

F

Capacitance

Tolerance

A = ±0.05pF

B = ±0.1pF

C = ±0.25pF

D = ±0.5pF

F = ±1%

G = ±2%

J = ±5%

9

Voltage

9 = 6.3V

8 = 10V

3 = 25V

5 = 50V

1 = 100V

A = 250V

G

Dielectric

G = C0G

A

Termination

Style

A = N/A

C

Termination Finish

C = 100% Matte Sn

TU

Packaging/Grade

(C-Spec)

TU = 7" Reel

Unmarked

Case Size Specification/

(L"x W")

Series

02 = 0201 C = Standard 2 Sig. Digits

04= 0402

+ Number of

06 = 0603

Zeros

08 = 0805

Use 9 for 1.0 -

9.9pF

Use 8 for 0.5 -

.99pF

ex. 2.2pF = 229

ex. 0.5pF = 508

One WORLD

One Brand

One Strategy

One Focus

One Team

One KEMET

C1030-1 • 4/6/2011

1

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications – CBR Series

Dimensions – Millimeters (Inches)

T

W

L

100% Tin or SnPb Plate

Nickel Plate

Electrodes

Conductive Metalization

Case

Size (in.) Size (mm)

0201

0402

0603

0805

0603

1005

1608

2012

L

Length

0.60 (.024) ± 0.03 (.001)

1.00 (.040) ± 0.05 (.002)

1.60 (.063) ± 0.10 (.004)

2.00 (.079) ± 0.20 (.008)

W

Width

0.30 (.012) ± 0.03 (.001)

0.50 (.020) ± 0.05 (.002)

0.80 (.031) ± 0.10 (.004)

1.25 (.049) ± 0.20 (.008)

T

Thickness

0.30 (.012) ± 0.03 (.001)

B

Bandwidth

Mounting

Technique

Solder Reflow

Only

Solder Wave

or Solder Reflow

0.15 (.006) ± 0.05 (.002)

0.25 (.010) + 0.05 (.002) /

0.50 (.020) ± 0.05 (.002)

-0.10 (.004)

0.80 (.031) ± 0.07 (.003) 0.40 (.016) ± 0.15 (.006)

0.85 (.031) ± 0.10 (.004) 0.50 (.020) ± 0.20 (.008)

Electrical Parameters/Characteristics

Item

Operating Temperature Range:

Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC):

Aging Rate (Max % Cap Loss/Decade Hour):

Dielectric Withstanding Voltage (DWV):

Quality Factor (Q):

Insulation Resistance (IR) Limit @ 25°C:

Insulation Resistance (IR) Limit @ 125°C:

-55°C to +125°C

0 ± 30PPM/ºC

0%

See Dielectric Withstanding Voltage Table

(5 ± 1 seconds and charge/discharge not exceeding 50mA)

≥ 1000 for capacitance values ≥ 30pF

≥ 400 + 20C for capacitance values < 30pF

10

5

Megohms minimum (Rated voltage applied for 120 ± 5 secs)

10

4

Megohms minimum (Rated voltage applied for 120 ± 5 secs)

Parameters/Characteristics

Capacitance and Quality Factor (Q) measured under the following conditions:

1MHz ± 100kHz and 1.0 ± 0.2 Vrms if capacitance ≤1000pF

1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance >1000pF

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic

Level Control (ALC). The ALC feature should be switched to "ON."

Dielectric Withstanding Voltage (DWV)

DWV

Rated Voltage (VDC)

250%

≤100V

200%

250V

Environmental Compliance

Pb-Free and RoHS compliant

C1030-1 • 4/6/2011

2

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications – CBR Series

Table 1 – CBR Series (0201 - 0805 Case Sizes)

Case Size (in.)

Voltage Code

Rated Voltage (VDC)

0201

9

6.3

8

10

3

25

5

50

0402

1

100

5

50

0603

1

100

A

250

5

50

0805

1

100

A

250

Cap

0.1 pF

0.2 pF

0.3 pF

0.4 pF

0.5 pF

0.6 pF

0.7 pF

0.8 pF

0.9 pF

1.0 pF

1.8 pF

2.2 pF

2.4 pF

2.7 pF

3.0 pF

3.3 pF

3.6 pF

3.9 pF

4.3 pF

4.7 pF

5.1 pF

5.6 pF

6.2 pF

6.8 pF

7.5 pF

8.2 pF

9.1 pF

10 pF

11 pF

12 pF

13 pF

15 pF

16 pF

18 pF

20 pF

22 pF

24 pF

27 pF

30 pF

33 pF

36 pF

39 pF

43 pF

47 pF

56 pF

68 pF

82 pF

100 pF

Cap Code

108

208

308

408

508

608

708

808

908

109

189

229

249

279

309

339

369

399

439

479

519

569

629

689

759

829

919

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

560

680

820

101

Capacitance & Capacitance Tolerance Availability

A, B, C

B, C, D

F, G, J

6.3

Cap

Cap Code

10

8

0201

25

3

50

5

0402

100

1

50

5

100

1

0603

250

A

50

5

100

1

0805

250

A

9

C1030-1 • 4/6/2011

3

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications – CBR Series

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reflow for 0603 & 0805 case sizes

• 0201 & 0402 case sizes are limited to solder reflow only

Recommended Soldering Profile:

• KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020

Recommended Solder Alloys: Pb-Free

Alloy

In50

In52

Sn62

Sn63

Pb-Free

Hi-Temp

Sn5

Composition

50 In, 50 Pb

52 In, 48 Sn

62.5 Sn, 36.1 Pb, 1.4 Ag

63 Sn, 37 Pb

95.5 Sn, 3.8 Ag, 0.7 Cu

5 Sn, 93.5 Pb, 1.5 Ag

5 Sn, 95 Pb

Solidus

180 °C

118 °C

179 °C

183 °C

217 °C

296 °C

308 °C

Liquidous

209 °C

118 °C

179 °C

183 °C

217 °C

301 °C

312 °C

C1030-1 • 4/6/2011

4

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications – CBR Series

Table 2 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351 (mm)

Case

Size

(in.)

0201

0402

0603

0805

Case

Size

(mm)

0603

1005

1608

2012

Density Level A:

Maximum (Most) Land

Protrusion

C

0.38

0.50

0.90

1.00

Y

0.56

0.72

1.15

1.35

X

0.52

0.72

1.10

1.55

V1

1.80

2.20

4.00

4.40

V2

1.00

1.20

2.10

2.60

C

0.33

0.45

0.80

0.90

Density Level B:

Median (Nominal) Land

Protrusion

Y

0.46

0.62

0.95

1.15

X

0.42

0.62

1.00

1.45

V1

1.50

1.90

3.10

3.50

V2

0.80

1.00

1.50

2.00

C

0.28

0.40

0.60

0.75

Density Level C:

Minimum (Least) Land

Protrusion

Y

0.36

0.52

0.75

0.95

X

0.32

0.52

0.90

1.35

V1

1.20

1.60

2.40

2.80

V2

0.60

0.80

1.20

1.70

Density Level A:

For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder

processes. KEMET only recommends wave soldering of 0603(1608) and 0805(2012) case sizes.

Density Level B:

For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.

Density Level C:

For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification

testing based on the conditions outlined in IPC standard 7351 (IPC-7351).

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp, and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40 degrees C, and maximum storage humidity not

exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts, and

atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability, chip stock should be used promptly,

preferably within 1.5 years of receipt.

C1030-1 • 4/6/2011

5

CBR02C330F9GACTU

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