Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Application
CBR Series, C0G Dielectric, Ultra High Q, Low ESR,
6.3VDC-250VDC (RF & Microwave)
Preliminary
Overview
KEMET’s CBR series surface mount multilayer ceramic capacitors
(MLCCs) in C0G dielectric feature a robust and exceptionally
stable base metal electrode dielectric system that provides
excellent low loss performance (High Q). These devices offer
extremely low ESR and high self-resonance characteristics, and
are well suited for resonant circuit applications or those where
Q and stability of capacitance characteristics are required. CRF
series capacitors exhibits no change in capacitance with respect
to time and voltage and boasts a negligible change in capacitance
with reference to ambient temperature. Capacitance change is
limited to ±30ppm/ºC from -55°C to +125°C.
CBR series devices are are suitable for many circuit applications
including RF power amplifiers, mixers, oscillators, low noise
amplifiers, filter networks, antenna tuning, timing circuits, delay
lines and MRI imaging coils.
Benefits
• -55°C to +125°C operating temperature range
• Ultra High Q
• Base metal electrode (BME) dielectric system
• Pb-Free and RoHS compliant
• 0201, 0402, 0603 and 0805 case sizes (inches)
• DC voltage ratings of 6.3V, 10V, 25V, 50V, 100V and 250V
• Capacitance offerings ranging from 0.1pF up to 100pF
• Available capacitance tolerances of ±0.05pF, ±0.1pF, ±0.25pF,
±0.5pF, ±1%, ±2%, ±5% and ±10%
• No piezoelectric noise
• Low ESR
• High thermal stability
• No capacitance change with respect to applied rated DC voltage
• Negligible capacitance change with respect to temperature
• No capacitance decay with time
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
Applications
Typical applications include critical timing, tuning, bypass,
coupling, feedback, filtering, impedance matching and DC
blocking.
Field applications include wireless and cellular base stations,
wireless LAN, subscriber based wireless services, wireless
broadcast equipment, satellite communications, RF PA modules,
filters, VCOs, PAs, matching networks, RF modules, satellite
communications and medical electronics.
Ordering Information
CBR
Series
CBR
02
C
330
Capacitance
Code (pF)
F
Capacitance
Tolerance
A = ±0.05pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
9
Voltage
9 = 6.3V
8 = 10V
3 = 25V
5 = 50V
1 = 100V
A = 250V
G
Dielectric
G = C0G
A
Termination
Style
A = N/A
C
Termination Finish
C = 100% Matte Sn
TU
Packaging/Grade
(C-Spec)
TU = 7" Reel
Unmarked
Case Size Specification/
(L"x W")
Series
02 = 0201 C = Standard 2 Sig. Digits
04= 0402
+ Number of
06 = 0603
Zeros
08 = 0805
Use 9 for 1.0 -
9.9pF
Use 8 for 0.5 -
.99pF
ex. 2.2pF = 229
ex. 0.5pF = 508
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C1030-1 • 4/6/2011
1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications – CBR Series
Dimensions – Millimeters (Inches)
T
W
L
100% Tin or SnPb Plate
Nickel Plate
Electrodes
Conductive Metalization
Case
Case
Size (in.) Size (mm)
0201
0402
0603
0805
0603
1005
1608
2012
L
Length
0.60 (.024) ± 0.03 (.001)
1.00 (.040) ± 0.05 (.002)
1.60 (.063) ± 0.10 (.004)
2.00 (.079) ± 0.20 (.008)
W
Width
0.30 (.012) ± 0.03 (.001)
0.50 (.020) ± 0.05 (.002)
0.80 (.031) ± 0.10 (.004)
1.25 (.049) ± 0.20 (.008)
T
Thickness
0.30 (.012) ± 0.03 (.001)
B
Bandwidth
Mounting
Technique
Solder Reflow
Only
Solder Wave
or Solder Reflow
0.15 (.006) ± 0.05 (.002)
0.25 (.010) + 0.05 (.002) /
0.50 (.020) ± 0.05 (.002)
-0.10 (.004)
0.80 (.031) ± 0.07 (.003) 0.40 (.016) ± 0.15 (.006)
0.85 (.031) ± 0.10 (.004) 0.50 (.020) ± 0.20 (.008)
Electrical Parameters/Characteristics
Item
Operating Temperature Range:
Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC):
Aging Rate (Max % Cap Loss/Decade Hour):
Dielectric Withstanding Voltage (DWV):
Quality Factor (Q):
Insulation Resistance (IR) Limit @ 25°C:
Insulation Resistance (IR) Limit @ 125°C:
-55°C to +125°C
0 ± 30PPM/ºC
0%
See Dielectric Withstanding Voltage Table
(5 ± 1 seconds and charge/discharge not exceeding 50mA)
≥ 1000 for capacitance values ≥ 30pF
≥ 400 + 20C for capacitance values < 30pF
10
5
Megohms minimum (Rated voltage applied for 120 ± 5 secs)
10
4
Megohms minimum (Rated voltage applied for 120 ± 5 secs)
Parameters/Characteristics
Capacitance and Quality Factor (Q) measured under the following conditions:
1MHz ± 100kHz and 1.0 ± 0.2 Vrms if capacitance ≤1000pF
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance >1000pF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic
Level Control (ALC). The ALC feature should be switched to "ON."
Dielectric Withstanding Voltage (DWV)
DWV
Rated Voltage (VDC)
250%
≤100V
200%
250V
Environmental Compliance
Pb-Free and RoHS compliant
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1030-1 • 4/6/2011
2
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications – CBR Series
Table 1 – CBR Series (0201 - 0805 Case Sizes)
Case Size (in.)
Voltage Code
Rated Voltage (VDC)
0201
9
6.3
8
10
3
25
5
50
0402
1
100
5
50
0603
1
100
A
250
5
50
0805
1
100
A
250
Cap
0.1 pF
0.2 pF
0.3 pF
0.4 pF
0.5 pF
0.6 pF
0.7 pF
0.8 pF
0.9 pF
1.0 pF
1.8 pF
2.2 pF
2.4 pF
2.7 pF
3.0 pF
3.3 pF
3.6 pF
3.9 pF
4.3 pF
4.7 pF
5.1 pF
5.6 pF
6.2 pF
6.8 pF
7.5 pF
8.2 pF
9.1 pF
10 pF
11 pF
12 pF
13 pF
15 pF
16 pF
18 pF
20 pF
22 pF
24 pF
27 pF
30 pF
33 pF
36 pF
39 pF
43 pF
47 pF
56 pF
68 pF
82 pF
100 pF
Cap Code
108
208
308
408
508
608
708
808
908
109
189
229
249
279
309
339
369
399
439
479
519
569
629
689
759
829
919
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
560
680
820
101
Capacitance & Capacitance Tolerance Availability
A, B, C
A, B, C
A, B, C
A, B, C
B, C, D
B, C, D
B, C, D
B, C, D
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
6.3
Cap
Cap Code
10
8
0201
25
3
50
5
0402
100
1
50
5
100
1
0603
250
A
50
5
100
1
0805
250
A
9
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1030-1 • 4/6/2011
3
Roll Over for
Order Info.
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications – CBR Series
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for 0603 & 0805 case sizes
• 0201 & 0402 case sizes are limited to solder reflow only
Recommended Soldering Profile:
• KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020
Recommended Solder Alloys: Pb-Free
Alloy
In50
In52
Sn62
Sn63
Pb-Free
Hi-Temp
Sn5
Composition
50 In, 50 Pb
52 In, 48 Sn
62.5 Sn, 36.1 Pb, 1.4 Ag
63 Sn, 37 Pb
95.5 Sn, 3.8 Ag, 0.7 Cu
5 Sn, 93.5 Pb, 1.5 Ag
5 Sn, 95 Pb
Solidus
180 °C
118 °C
179 °C
183 °C
217 °C
296 °C
308 °C
Liquidous
209 °C
118 °C
179 °C
183 °C
217 °C
301 °C
312 °C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1030-1 • 4/6/2011
4
Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications – CBR Series
Table 2 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351 (mm)
Case
Size
(in.)
0201
0402
0603
0805
Case
Size
(mm)
0603
1005
1608
2012
Density Level A:
Maximum (Most) Land
Protrusion
C
0.38
0.50
0.90
1.00
Y
0.56
0.72
1.15
1.35
X
0.52
0.72
1.10
1.55
V1
1.80
2.20
4.00
4.40
V2
1.00
1.20
2.10
2.60
C
0.33
0.45
0.80
0.90
Density Level B:
Median (Nominal) Land
Protrusion
Y
0.46
0.62
0.95
1.15
X
0.42
0.62
1.00
1.45
V1
1.50
1.90
3.10
3.50
V2
0.80
1.00
1.50
2.00
C
0.28
0.40
0.60
0.75
Density Level C:
Minimum (Least) Land
Protrusion
Y
0.36
0.52
0.75
0.95
X
0.32
0.52
0.90
1.35
V1
1.20
1.60
2.40
2.80
V2
0.60
0.80
1.20
1.70
Density Level A:
For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of 0603(1608) and 0805(2012) case sizes.
Density Level B:
For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C:
For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp, and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40 degrees C, and maximum storage humidity not
exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts, and
atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability, chip stock should be used promptly,
preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1030-1 • 4/6/2011
5
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