IC IC,OP-AMP,QUAD,BIPOLAR,DIP,14PIN,CERAMIC, Operational Amplifier
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 25C 时的最大偏置电流 (IIB) | 0.03 µA |
| 频率补偿 | YES |
| 最大输入失调电压 | 290 µV |
| JESD-30 代码 | R-XDIP-T14 |
| JESD-609代码 | e0 |
| 低-失调 | YES |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 4 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 最小摆率 | 2 V/us |
| 最大压摆率 | 13 mA |
| 供电电压上限 | 22 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 最小电压增益 | 700000 |
| LT1125MJ/883 | LT1124MJ8/883 | LT1124AMJ8/883 | LT1125AMJ/883 | LT1125AMJ/883C | LT1125MJ/883C | |
|---|---|---|---|---|---|---|
| 描述 | IC IC,OP-AMP,QUAD,BIPOLAR,DIP,14PIN,CERAMIC, Operational Amplifier | IC IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,CERAMIC, Operational Amplifier | IC IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,CERAMIC, Operational Amplifier | IC IC,OP-AMP,QUAD,BIPOLAR,DIP,14PIN,CERAMIC, Operational Amplifier | IC IC,OP-AMP,QUAD,BIPOLAR,DIP,14PIN,CERAMIC, Operational Amplifier | IC IC,OP-AMP,QUAD,BIPOLAR,DIP,14PIN,CERAMIC, Operational Amplifier |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| 针数 | 14 | 8 | 8 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 25C 时的最大偏置电流 (IIB) | 0.03 µA | 0.03 µA | 0.02 µA | 0.02 µA | 0.02 µA | 0.03 µA |
| 频率补偿 | YES | YES | YES | YES | YES | YES |
| 最大输入失调电压 | 290 µV | 250 µV | 170 µV | 190 µV | 190 µV | 290 µV |
| JESD-30 代码 | R-XDIP-T14 | R-CDIP-T8 | R-CDIP-T8 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 低-失调 | YES | YES | YES | YES | YES | YES |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 4 | 2 | 2 | 4 | 4 | 4 |
| 端子数量 | 14 | 8 | 8 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP14,.3 | DIP8,.3 | DIP8,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | MIL-STD-883 Class B | MIL-STD-883 Class B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 最小摆率 | 2 V/us | 2 V/us | 2.3 V/us | 2.3 V/us | 2.3 V/us | 2 V/us |
| 最大压摆率 | 13 mA | 6.5 mA | 6.5 mA | 13 mA | 13 mA | 13 mA |
| 供电电压上限 | 22 V | 22 V | 22 V | 22 V | 22 V | 22 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 最小电压增益 | 700000 | 700000 | 1000000 | 1000000 | 1000000 | 700000 |
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