4KX4 STANDARD SRAM, 25ns, PDIP20, 0.300 INCH, PLASTIC, DIP-20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ST(意法半导体) |
零件包装代码 | DIP |
包装说明 | 0.300 INCH, PLASTIC, DIP-20 |
针数 | 20 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最长访问时间 | 25 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDIP-T20 |
JESD-609代码 | e0 |
长度 | 26.289 mm |
内存密度 | 16384 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 4 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 20 |
字数 | 4096 words |
字数代码 | 4000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 4KX4 |
输出特性 | 3-STATE |
可输出 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP20,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 5.334 mm |
最小待机电流 | 2 V |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
MK41H68N-25 | MK41H68N-35 | MK41H69N-20 | MK41H68N-20 | MK41H69N-25 | |
---|---|---|---|---|---|
描述 | 4KX4 STANDARD SRAM, 25ns, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | 4KX4 STANDARD SRAM, 35ns, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | 4KX4 STANDARD SRAM, 20ns, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | 4KX4 STANDARD SRAM, 20ns, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | 4KX4 STANDARD SRAM, 25ns, PDIP20, 0.300 INCH, PLASTIC, DIP-20 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
零件包装代码 | DIP | DIP | DIP | DIP | DIP |
包装说明 | 0.300 INCH, PLASTIC, DIP-20 | 0.300 INCH, PLASTIC, DIP-20 | 0.300 INCH, PLASTIC, DIP-20 | 0.300 INCH, PLASTIC, DIP-20 | 0.300 INCH, PLASTIC, DIP-20 |
针数 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 25 ns | 35 ns | 20 ns | 20 ns | 25 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
长度 | 26.289 mm | 26.289 mm | 26.289 mm | 26.289 mm | 26.289 mm |
内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bi |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 |
字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 4KX4 | 4KX4 | 4KX4 | 4KX4 | 4KX4 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | NO | NO | NO | NO | NO |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.334 mm | 5.334 mm | 5.334 mm | 5.334 mm | 5.334 mm |
最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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