UPD78214GC-XXX-AB8
参数名称 | 属性值 |
Brand Name | Renesas |
厂商名称 | Renesas(瑞萨电子) |
零件包装代码 | QFP |
包装说明 | QFP, QFP64,.7SQ,32 |
针数 | 64 |
Reach Compliance Code | unknown |
具有ADC | YES |
地址总线宽度 | 20 |
位大小 | 8 |
CPU系列 | UPD78K2 |
最大时钟频率 | 12 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | 8 |
JESD-30 代码 | S-PQFP-G64 |
JESD-609代码 | e0 |
长度 | 14 mm |
I/O 线路数量 | 54 |
端子数量 | 64 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装等效代码 | QFP64,.7SQ,32 |
封装形状 | SQUARE |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
RAM(字节) | 512 |
ROM(单词) | 16384 |
ROM可编程性 | MROM |
座面最大高度 | 2.85 mm |
速度 | 12 MHz |
最大压摆率 | 40 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | MOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 14 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
UPD78214GC-XXX-AB8 | UPD78212GC-XXX-AB8 | UPD78212CW-XXX | UPD78213GC-AB8 | UPD78213GQ-36 | UPD78213GJ-XXX-5BJ | UPD78213GC-XXX-AB8 | UPD78213L | UPD78214CW-XXX | UPD78214GJ-XXX-5BJ | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | UPD78214GC-XXX-AB8 | 8-BIT, MROM, 12MHz, MICROCONTROLLER, PQFP64, 14 X 14 MM, PLASTIC, QFP-64 | 8-BIT, MROM, 12MHz, MICROCONTROLLER, PDIP64, 0.750 INCH, PLASTIC, SDIP-64 | UPD78213GC-AB8 | UPD78213GQ-36 | UPD78213GJ-XXX-5BJ | UPD78213GC-XXX-AB8 | 8-BIT, 12MHz, MICROCONTROLLER, PQCC68, 0.950 INCH, PLASTIC, QFJ-68 | 8-BIT, MROM, 12MHz, MICROCONTROLLER, PDIP64, 0.750 INCH, PLASTIC, SDIP-64 | 8-BIT, MROM, 12MHz, MICROCONTROLLER, PQFP74, 20 X 20 MM, PLASTIC, QFP-74 |
包装说明 | QFP, QFP64,.7SQ,32 | QFP, QFP64,.7SQ,32 | SDIP, SDIP64,.75 | QFP, QFP64,.7SQ,32 | DIP, QUIP64A,.7/.9 | , | , | QCCJ, LDCC68,1.0SQ | SDIP, SDIP64,.75 | QFP, QFP74,.9SQ,40 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
零件包装代码 | QFP | QFP | DIP | QFP | DIP | - | - | QFJ | DIP | QFP |
针数 | 64 | 64 | 64 | 64 | 64 | - | - | 68 | 64 | 74 |
具有ADC | YES | YES | YES | YES | YES | - | - | YES | YES | YES |
地址总线宽度 | 20 | 20 | 20 | 20 | 20 | - | - | 20 | 20 | 20 |
位大小 | 8 | 8 | 8 | 8 | 8 | - | - | 8 | 8 | 8 |
CPU系列 | UPD78K2 | UPD78K2 | UPD78K2 | UPD78K2 | UPD78K2 | - | - | UPD78K2 | UPD78K2 | UPD78K2 |
最大时钟频率 | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | - | - | 12 MHz | 12 MHz | 12 MHz |
DAC 通道 | NO | NO | NO | NO | NO | - | - | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | - | - | NO | NO | NO |
外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | - | - | 8 | 8 | 8 |
JESD-30 代码 | S-PQFP-G64 | S-PQFP-G64 | R-PDIP-T64 | S-PQFP-G64 | R-PDIP-T64 | - | - | S-PQCC-J68 | R-PDIP-T64 | S-PQFP-G74 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | - | e0 | e0 | e0 |
长度 | 14 mm | 14 mm | 58 mm | 14 mm | 41.5 mm | - | - | 24.2 mm | 58 mm | 20 mm |
I/O 线路数量 | 54 | 54 | 54 | 36 | 36 | - | - | 36 | 54 | 54 |
端子数量 | 64 | 64 | 64 | 64 | 64 | - | - | 68 | 64 | 74 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | - | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | YES | YES | YES | YES | - | - | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QFP | SDIP | QFP | DIP | - | - | QCCJ | SDIP | QFP |
封装等效代码 | QFP64,.7SQ,32 | QFP64,.7SQ,32 | SDIP64,.75 | QFP64,.7SQ,32 | QUIP64A,.7/.9 | - | - | LDCC68,1.0SQ | SDIP64,.75 | QFP74,.9SQ,40 |
封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | - | - | SQUARE | RECTANGULAR | SQUARE |
封装形式 | FLATPACK | FLATPACK | IN-LINE, SHRINK PITCH | FLATPACK | IN-LINE | - | - | CHIP CARRIER | IN-LINE, SHRINK PITCH | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 512 | 384 | 384 | 512 | 512 | - | - | 512 | 512 | 512 |
座面最大高度 | 2.85 mm | 2.85 mm | 5.08 mm | 2.85 mm | 3.7 mm | - | - | 4.6 mm | 5.08 mm | 4 mm |
速度 | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | - | - | 12 MHz | 12 MHz | 12 MHz |
最大压摆率 | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA | - | - | 40 mA | 40 mA | 40 mA |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | YES | NO | - | - | YES | NO | YES |
技术 | MOS | MOS | MOS | MOS | MOS | - | - | MOS | MOS | MOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | - | - | J BEND | THROUGH-HOLE | GULL WING |
端子节距 | 0.8 mm | 0.8 mm | 1.778 mm | 0.8 mm | 1.27 mm | - | - | 1.27 mm | 1.778 mm | 1 mm |
端子位置 | QUAD | QUAD | DUAL | QUAD | DUAL | - | - | QUAD | DUAL | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 14 mm | 14 mm | 19.05 mm | 14 mm | 24.13 mm | - | - | 24.2 mm | 19.05 mm | 20 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | - | - | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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