DDR DRAM Module, 32MX72, 0.75ns, CMOS, LEAD FREE, DIMM-184
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Infineon(英飞凌) |
零件包装代码 | DIMM |
包装说明 | DIMM, DIMM184 |
针数 | 184 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
访问模式 | SINGLE BANK PAGE BURST |
最长访问时间 | 0.75 ns |
其他特性 | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 133 MHz |
I/O 类型 | COMMON |
JESD-30 代码 | R-XDMA-N184 |
JESD-609代码 | e3 |
内存密度 | 2415919104 bit |
内存集成电路类型 | DDR DRAM MODULE |
内存宽度 | 72 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 184 |
字数 | 33554432 words |
字数代码 | 32000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 32MX72 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装代码 | DIMM |
封装等效代码 | DIMM184 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 2.5 V |
认证状态 | Not Qualified |
刷新周期 | 8192 |
自我刷新 | YES |
最大待机电流 | 0.37 A |
最大压摆率 | 2.1 mA |
最大供电电压 (Vsup) | 2.7 V |
最小供电电压 (Vsup) | 2.3 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
HYS72D32300HBR-7-C | HYS72D64320HBR-6-C | HYS72D32300HBR-6-C | HYS72D64300HBR-5-C | HYS72D32300HBR-5-C | HYS72D128320HBR-6-C | HYS72D128320HBR-7-C | HYS72D64300HBR-6-C | HYS72D64300HBR-7-C | HYS72D64320HBR-5-C | |
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描述 | DDR DRAM Module, 32MX72, 0.75ns, CMOS, LEAD FREE, DIMM-184 | DDR DRAM Module, 64MX72, 0.7ns, CMOS, LEAD FREE, DIMM-184 | DDR DRAM Module, 32MX72, 0.7ns, CMOS, LEAD FREE, DIMM-184 | DDR DRAM Module, 64MX72, 0.5ns, CMOS, LEAD FREE, DIMM-184 | DDR DRAM Module, 32MX72, 0.5ns, CMOS, LEAD FREE, DIMM-184 | DDR DRAM Module, 128MX72, 0.7ns, CMOS, LEAD FREE, DIMM-184 | DDR DRAM Module, 128MX72, 0.75ns, CMOS, LEAD FREE, DIMM-184 | DDR DRAM Module, 64MX72, 0.7ns, CMOS, LEAD FREE, DIMM-184 | DDR DRAM Module, 64MX72, 0.75ns, CMOS, LEAD FREE, DIMM-184 | DDR DRAM Module, 64MX72, 0.5ns, CMOS, LEAD FREE, DIMM-184 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
包装说明 | DIMM, DIMM184 | DIMM, DIMM184 | DIMM, DIMM184 | DIMM, DIMM184 | DIMM, DIMM184 | DIMM, DIMM184 | DIMM, DIMM184 | DIMM, DIMM184 | DIMM, DIMM184 | DIMM, DIMM184 |
针数 | 184 | 184 | 184 | 184 | 184 | 184 | 184 | 184 | 184 | 184 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | SINGLE BANK PAGE BURST | DUAL BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | DUAL BANK PAGE BURST |
最长访问时间 | 0.75 ns | 0.7 ns | 0.7 ns | 0.5 ns | 0.5 ns | 0.7 ns | 0.75 ns | 0.7 ns | 0.75 ns | 0.5 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 133 MHz | 166 MHz | 166 MHz | 200 MHz | 200 MHz | 166 MHz | 133 MHz | 166 MHz | 133 MHz | 200 MHz |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 | R-XDMA-N184 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
内存密度 | 2415919104 bit | 4831838208 bit | 2415919104 bit | 4831838208 bit | 2415919104 bit | 9663676416 bit | 9663676416 bit | 4831838208 bit | 4831838208 bit | 4831838208 bit |
内存集成电路类型 | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE |
内存宽度 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 184 | 184 | 184 | 184 | 184 | 184 | 184 | 184 | 184 | 184 |
字数 | 33554432 words | 67108864 words | 33554432 words | 67108864 words | 33554432 words | 134217728 words | 134217728 words | 67108864 words | 67108864 words | 67108864 words |
字数代码 | 32000000 | 64000000 | 32000000 | 64000000 | 32000000 | 128000000 | 128000000 | 64000000 | 64000000 | 64000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 32MX72 | 64MX72 | 32MX72 | 64MX72 | 32MX72 | 128MX72 | 128MX72 | 64MX72 | 64MX72 | 64MX72 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
封装等效代码 | DIMM184 | DIMM184 | DIMM184 | DIMM184 | DIMM184 | DIMM184 | DIMM184 | DIMM184 | DIMM184 | DIMM184 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 2.5 V | 2.5 V | 2.5 V | 2.6 V | 2.6 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.6 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
最大压摆率 | 2.1 mA | 3.17 mA | 2.58 mA | 5.5 mA | 2.95 mA | 5.94 mA | 4.88 mA | 4.76 mA | 3.83 mA | 3.66 mA |
最大供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.5 V | 2.5 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.5 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.6 V | 2.6 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.6 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
厂商名称 | Infineon(英飞凌) | - | - | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) |
最大待机电流 | 0.37 A | - | 0.41 A | 0.79 A | 0.44 A | - | - | 0.71 A | 0.61 A | - |
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