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IDT7M7004S95CHB: 产品描述EEPROM Module, 128KX8, 95ns, Parallel, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66; 产品类别存储存储; 文件大小165KB，共5页; 制造商IDT (Integrated Device Technology)

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IDT7M7004S95CHB概述

EEPROM Module, 128KX8, 95ns, Parallel, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66

IDT7M7004S95CHB规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	PGA
包装说明	SIDE BRAZED, CERAMIC, HIP-66
针数	66
Reach Compliance Code	not_compliant
ECCN代码	3A001.A.2.C
最长访问时间	95 ns
其他特性	USER CONFIGURABLE AS 32K X 32
数据轮询	YES
JESD-30 代码	S-CPGA-P66
JESD-609代码	e0
内存密度	1048576 bit
内存集成电路类型	EEPROM MODULE
内存宽度	8
功能数量	1
端子数量	66
字数	131072 words
字数代码	128000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	128KX8
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	PGA
封装等效代码	PGA66,11X11
封装形状	SQUARE
封装形式	GRID ARRAY
页面大小	64 words
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	5 V
编程电压	5 V
认证状态	Not Qualified
筛选级别	MIL-STD-883 Class B (Modified)
座面最大高度	6.223 mm
最大待机电流	0.012 A
最大压摆率	0.32 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	MILITARY
端子面层	Tin/Lead (Sn/Pb)
端子形式	PIN/PEG
端子节距	2.54 mm
端子位置	PERPENDICULAR
处于峰值回流温度下的最长时间	NOT SPECIFIED
切换位	NO

IDT7M7004S95CHB相似产品对比

	IDT7M7004S95CHB	IDT7M7004S125CHB	IDT7M7004S200CHB	IDT7M7004S200CH	IDT7M7004S75CH	IDT7M7004S125CH	IDT7M7004S95CH	IDT7M7004S75CHB	IDT7M7004S150CHB	IDT7M7004S150CH
描述	EEPROM Module, 128KX8, 95ns, Parallel, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66	EEPROM Module, 128KX8, 125ns, Parallel, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66	EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66	EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66	EEPROM Module, 128KX8, 75ns, Parallel, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66	EEPROM Module, 128KX8, 125ns, Parallel, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66	EEPROM Module, 128KX8, 95ns, Parallel, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66	EEPROM Module, 128KX8, 75ns, Parallel, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66	EEPROM Module, 128KX8, 150ns, Parallel, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66	EEPROM Module, 128KX8, 150ns, Parallel, CMOS, CPGA66, SIDE BRAZED, CERAMIC, HIP-66
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	PGA	PGA	PGA	PGA	PGA	PGA	PGA	PGA	PGA	PGA
包装说明	SIDE BRAZED, CERAMIC, HIP-66	SIDE BRAZED, CERAMIC, HIP-66	SIDE BRAZED, CERAMIC, HIP-66	SIDE BRAZED, CERAMIC, HIP-66	SIDE BRAZED, CERAMIC, HIP-66	SIDE BRAZED, CERAMIC, HIP-66	SIDE BRAZED, CERAMIC, HIP-66	SIDE BRAZED, CERAMIC, HIP-66	SIDE BRAZED, CERAMIC, HIP-66	SIDE BRAZED, CERAMIC, HIP-66
针数	66	66	66	66	66	66	66	66	66	66
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	_compli
ECCN代码	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	EAR99	3A991.B.1.B.2	EAR99	EAR99	3A001.A.2.C	3A001.A.2.C	EAR99
最长访问时间	95 ns	125 ns	200 ns	200 ns	75 ns	125 ns	95 ns	75 ns	150 ns	150 ns
其他特性	USER CONFIGURABLE AS 32K X 32	USER CONFIGURABLE AS 32K X 32	USER CONFIGURABLE AS 32K X 32	USER CONFIGURABLE AS 32K X 32	USER CONFIGURABLE AS 32K X 32	USER CONFIGURABLE AS 32K X 32	USER CONFIGURABLE AS 32K X 32	USER CONFIGURABLE AS 32K X 32	USER CONFIGURABLE AS 32K X 32	USER CONFIGURABLE AS 32K X 32
数据轮询	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66	S-CPGA-P66
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
内存密度	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bi
内存集成电路类型	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE	EEPROM MODULE
内存宽度	8	8	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	66	66	66	66	66	66	66	66	66	66
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000	128000	128000	128000	128000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	125 °C	125 °C	70 °C	70 °C	70 °C	70 °C	125 °C	125 °C	70 °C
组织	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	PGA	PGA	PGA	PGA	PGA	PGA	PGA	PGA	PGA	PGA
封装等效代码	PGA66,11X11	PGA66,11X11	PGA66,11X11	PGA66,11X11	PGA66,11X11	PGA66,11X11	PGA66,11X11	PGA66,11X11	PGA66,11X11	PGA66,11X11
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
页面大小	64 words	64 words	64 words	64 words	64 words	64 words	64 words	64 words	64 words	64 words
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
编程电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	6.223 mm	6.223 mm	6.223 mm	6.223 mm	6.223 mm	6.223 mm	6.223 mm	6.223 mm	6.223 mm	6.223 mm
最大待机电流	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A
最大压摆率	0.32 mA	0.32 mA	0.32 mA	0.32 mA	0.32 mA	0.32 mA	0.32 mA	0.32 mA	0.32 mA	0.32 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
端子节距	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
切换位	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-	-	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

IDT7M7004S95CHB

IDT7M7004S95CHB概述

IDT7M7004S95CHB规格参数

IDT7M7004S95CHB相似产品对比

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