UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32
| 参数名称 | 属性值 |
| 厂商名称 | Rochester Electronics |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 最长访问时间 | 200 ns |
| JESD-30 代码 | R-CDIP-T32 |
| 长度 | 41.91 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 128KX8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 座面最大高度 | 4.907 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| TMS27C010-200JL | TMS27C010-170JL | TMS27C010-25JL | TMS27C010-300JL | TMS27C010-30JL | |
|---|---|---|---|---|---|
| 描述 | UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 | UVPROM, 128KX8, 170ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 | UVPROM, 128KX8, 250ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 | UVPROM, 128KX8, 300ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 | UVPROM, 128KX8, 300ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 包装说明 | DIP, | DIP, | DIP, | DIP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 200 ns | 170 ns | 250 ns | 300 ns | 300 ns |
| JESD-30 代码 | R-CDIP-T32 | R-CDIP-T32 | R-CDIP-T32 | R-CDIP-T32 | R-CDIP-T32 |
| 长度 | 41.91 mm | 41.91 mm | 41.91 mm | 41.91 mm | 41.91 mm |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 座面最大高度 | 4.907 mm | 4.907 mm | 4.907 mm | 4.907 mm | 4.907 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
stm32/stm8
传感器
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