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SKIIP232GDL120-410CTVFE

产品描述Full Bridge Based Peripheral Driver, 250A
产品类别模拟混合信号IC    驱动程序和接口   
文件大小29KB,共2页
制造商SEMIKRON
官网地址http://www.semikron.com
下载文档 详细参数 选型对比 全文预览

SKIIP232GDL120-410CTVFE概述

Full Bridge Based Peripheral Driver, 250A

SKIIP232GDL120-410CTVFE规格参数

参数名称属性值
包装说明,
Reach Compliance Codeunknow
ECCN代码EAR99
内置保护TRANSIENT; OVER CURRENT; THERMAL
接口集成电路类型FULL BRIDGE BASED PERIPHERAL DRIVER
JESD-30 代码R-XXMA-X
功能数量1
最高工作温度85 °C
最低工作温度-25 °C
输出电流流向SOURCE AND SINK
标称输出峰值电流250 A
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
认证状态Not Qualified
标称供电电压15 V
表面贴装NO
温度等级OTHER
端子形式UNSPECIFIED
端子位置UNSPECIFIED
Base Number Matches1

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SKiiP 3-phase bridge
Absolute Maximum Ratings
Symbol
V
isol
T
op
,T
stg
4)
Conditions
1)
Values
3000
-25...+85
1200
900
200
-40...+150
200
400
1440
10
18
30
20
75
Units
V
°C
V
V
A
°C
A
A
A
2
kAs
V
V
kHz
kV/µs
AC, 1min
Operating / stor. temperature
IGBT and Inverse Diode
V
CES
5)
V
CC
Operating DC link voltage
I
C
IGBT
3)
T
j
IGBT + Diode
I
F
Diode
I
FM
Diode, t
p
< 1 ms
I
FSM
Diode, T
j
= 150 °C, 10ms; sin
2
I t (Diode) Diode, T
j
= 150 °C, 10ms
Driver
V
S1
Stabilized Power Supply
V
S2
Non-stabilized Power Supply
f
smax
Switching frequency
dV/dt
Primary to secondary side
SKiiPPACK
®
SK integrated intelligent
Power PACK
3-phase bridge with
brake chopper (E/A)
SKiiP
7,9)
232 GDL 120 - 410 CTV
Preliminary Data
Case S5GDL
Characteristics
Symbol
11)
IGBT
V
(BR)CES
I
CES
V
TO
r
T
V
Cesat
V
Cesat
E
on
+ E
off
C
CHC
L
CE
Conditions
1)
min.
≥V
CES
typ.
10
1,4
15
0,91
5,7
max.
0,4
1,38
10,5
3,2
3,05
60/98
2,45
2,55
8
0,129
0,375
0,033
Units
V
mA
mA
V
mΩ
V
V
mJ
nF
nH
V
V
mJ
V
mΩ
°C/W
°C/W
°C/W
mA
mA
µs
A
A
°C
V
Driver without supply
V
GE
= 0,
T
j
= 25 °C
T
j
= 125 °C
V
CE
= V
CES
T
j
= 125 °C
T
j
= 125 °C
I
C
= 175A,
T
j
= 125 °C
I
C
= 175A,
T
j
= 25 °C
V
CC
=600/900V,I
C
=200A
T
j
= 125 °C
per SkiiP, AC side
Top, Bottom
2)
Inverse Diode
V
F
= V
EC
I
F
= 175A;
V
F
= V
EC
I
F
= 175A;
E
on
+ E
off
I
F
= 200A;
V
TO
T
j
= 125 °C
r
T
T
j
= 125 °C
Features
Short circuit protection, due to
evaluation of current sensor
signals
Isolated power supply
Low thermal impedance
Optimal thermal management
with integrated heatsink
Pressure contact technology
with increased power cycling
capability, compact design
Low stray inductance
High power, small losses
Over-temperature protection
1)
T
j
= 125 °C
T
j
= 25 °C
T
j
= 125 °C
2)
3)
4)
Thermal Characteristics
10)
R
thjs
per IGBT
10)
R
thjs
per Diode
6,10)
R
thsa
P16 heatsink; see case
Driver
I
S1
Supply current 15V-supply
I
S2
Supply current 24V-supply
t
interlock-driver
Interlock-time
SKiiPPACK protection
I
TRIPSC
Short circuit protection
I
TRIPLG
Ground fault protection
T
TRIP
Over-temp. protection
9)
U
DCTRIP
U
DC
-protection
Mechanical Data
M1
DC terminals, SI Units
M2
AC terminals, SI Units
5)
6)
7)
340+360*f
s
/f
smax
+3,5*I
AC
/A
250+240*f
s
/f
smax
+2,6*I
AC
/A
2,3
250
±
2%
58 +/- 2%
115
±
5%
920
±
2%
4
8
28.01.99
6
10
9)
10)
11)
T
heatsink
= 25 °C, unless
otherwise specified
CAL = Controlled Axial Lifetime
Technology (soft and fast)
without driver
Driver input to DC link/ AC
output to heatsink
with Semikron-DC link (low
inductance)
other heatsinks on request
C - Integrated current sensors
T - Temperature protection
V - 15 V or 24 V power supply
options available for driver:
U - DC link voltage sense
F – Fiber optic connector
s
” referenced to temperature
sensor
NPT-technology with homo-
genous current-distribution
Nm
Nm
©by
SEMIKRON

SKIIP232GDL120-410CTVFE相似产品对比

SKIIP232GDL120-410CTVFE SKIIP232GDL120-410CTVA SMA5VG-CB2-R SKIIP232GDL120-410CTVUE SKIIP232GDL120-410CTVF SKIIP232GDL120-410CTVU SKIIP232GDL120-410CTVE SKIIP232GDL120-410CTVFA
描述 Full Bridge Based Peripheral Driver, 250A Half Bridge Based Peripheral Driver, 250A SURFACE MOUNT SILICON ZENER DIODE Full Bridge Based Peripheral Driver, 250A Half Bridge Based Peripheral Driver, 250A Half Bridge Based Peripheral Driver, 250A Half Bridge Based Peripheral Driver, 250A Full Bridge Based Peripheral Driver, 250A
Reach Compliance Code unknow unknow - unknow unknow unknow unknow unknow
ECCN代码 EAR99 EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99
内置保护 TRANSIENT; OVER CURRENT; THERMAL TRANSIENT; OVER CURRENT; THERMAL - TRANSIENT; OVER CURRENT; THERMAL TRANSIENT; OVER CURRENT; THERMAL TRANSIENT; OVER CURRENT; THERMAL TRANSIENT; OVER CURRENT; THERMAL TRANSIENT; OVER CURRENT; THERMAL
接口集成电路类型 FULL BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER - FULL BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER FULL BRIDGE BASED PERIPHERAL DRIVER
JESD-30 代码 R-XXMA-X R-XXMA-X - R-XXMA-X R-XXMA-X R-XXMA-X R-XXMA-X R-XXMA-X
功能数量 1 1 - 1 1 1 1 1
最高工作温度 85 °C 85 °C - 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -25 °C -25 °C - -25 °C -25 °C -25 °C -25 °C -25 °C
输出电流流向 SOURCE AND SINK SOURCE AND SINK - SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK
标称输出峰值电流 250 A 250 A - 250 A 250 A 250 A 250 A 250 A
封装主体材料 UNSPECIFIED UNSPECIFIED - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
认证状态 Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
标称供电电压 15 V 15 V - 15 V 15 V 15 V 15 V 15 V
表面贴装 NO NO - NO NO NO NO NO
温度等级 OTHER OTHER - OTHER OTHER OTHER OTHER OTHER
端子形式 UNSPECIFIED UNSPECIFIED - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
端子位置 UNSPECIFIED UNSPECIFIED - UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Base Number Matches 1 1 - 1 1 1 1 1
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