Micro Peripheral IC, CMOS, CQFP132,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Thomson Electron Tubes & Devices Corp |
| 包装说明 | QFP, QFP132,1.08SQ |
| Reach Compliance Code | unknown |
| JESD-30 代码 | S-XQFP-G132 |
| JESD-609代码 | e0 |
| 端子数量 | 132 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | QFP |
| 封装等效代码 | QFP132,1.08SQ |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | QUAD |
| TS68302DESC01YA | TS68302DESC01XC | TS68302VR16 | TS68302MR16 | TS68302MA16 | TS68302VA16 | TS68302MA7B/C16 | |
|---|---|---|---|---|---|---|---|
| 描述 | Micro Peripheral IC, CMOS, CQFP132, | Micro Peripheral IC, CMOS, CPGA132, | Micro Peripheral IC, CMOS, CPGA132, | Micro Peripheral IC, CMOS, CPGA132, | Micro Peripheral IC, CMOS, CQFP132, | Micro Peripheral IC, CMOS, CQFP132, | Micro Peripheral IC, CMOS, CQFP132, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QFP, QFP132,1.08SQ | PGA, PGA132,13X13 | PGA, PGA132,13X13 | PGA, PGA132,13X13 | BQFP, SPQFP132,1.1SQ | BQFP, SPQFP132,1.1SQ | QFP, QFP132,1.08SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| JESD-30 代码 | S-XQFP-G132 | S-XPGA-P132 | S-XPGA-P132 | S-XPGA-P132 | S-XQFP-G132 | S-XQFP-G132 | S-XQFP-G132 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 132 | 132 | 132 | 132 | 132 | 132 | 132 |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -40 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | QFP | PGA | PGA | PGA | BQFP | BQFP | QFP |
| 封装等效代码 | QFP132,1.08SQ | PGA132,13X13 | PGA132,13X13 | PGA132,13X13 | SPQFP132,1.1SQ | SPQFP132,1.1SQ | QFP132,1.08SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | GRID ARRAY | GRID ARRAY | GRID ARRAY | FLATPACK | FLATPACK | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | PIN/PEG | PIN/PEG | PIN/PEG | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 2.54 mm | 2.54 mm | 2.54 mm | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | QUAD | QUAD | QUAD |
| 厂商名称 | Thomson Electron Tubes & Devices Corp | - | - | Thomson Electron Tubes & Devices Corp | Thomson Electron Tubes & Devices Corp | Thomson Electron Tubes & Devices Corp | Thomson Electron Tubes & Devices Corp |
嵌入式系统
模拟电子
综合技术交流
电源技术
FPGA/CPLD
电子竞赛
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
