IC HC/UH SERIES, 2-INPUT AND GATE, PDSO5, 0.95 MM PITCH, PLASTIC, SSOP-5, Gate
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Toshiba(东芝) |
零件包装代码 | SSOP |
包装说明 | 0.95 MM PITCH, PLASTIC, SSOP-5 |
针数 | 5 |
Reach Compliance Code | unknown |
系列 | HC/UH |
JESD-30 代码 | R-PDSO-G5 |
JESD-609代码 | e0 |
长度 | 2.9 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | AND GATE |
最大I(ol) | 0.008 A |
功能数量 | 1 |
输入次数 | 2 |
端子数量 | 5 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LSSOP |
封装等效代码 | TSOP5/6,.11,37 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
包装方法 | TAPE AND REEL |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 10.3 ns |
传播延迟(tpd) | 10.3 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
座面最大高度 | 1.4 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.95 mm |
端子位置 | DUAL |
宽度 | 1.6 mm |
TC7SET08FTE85L | TC7SET08FU(T5L,F,T) | TC7SET08FU(TE85L,F) | TC7SET08F(TE85L,F) | TC7SET08F(T5L,F,T) | |
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描述 | IC HC/UH SERIES, 2-INPUT AND GATE, PDSO5, 0.95 MM PITCH, PLASTIC, SSOP-5, Gate | IC AHCT/VHCT/VT SERIES, 2-INPUT AND GATE, PDSO5, 0.65 MM PITCH, PLASTIC, SSOP-5, Gate | IC,LOGIC GATE,2-INPUT AND,CMOS,TSSOP,5PIN,PLASTIC | IC,LOGIC GATE,2-INPUT AND,CMOS,TSOP,5PIN,PLASTIC | IC AHCT/VHCT/VT SERIES, 2-INPUT AND GATE, PDSO5, 0.95 MM PITCH, PLASTIC, SSOP-5, Gate |
是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 |
逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
端子数量 | 5 | 5 | 5 | 5 | 5 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LSSOP | TSSOP | TSSOP | TSOP | LSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.95 mm | 0.65 mm | 0.635 mm | 0.95 mm | 0.95 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
零件包装代码 | SSOP | SSOP | - | - | SSOP |
包装说明 | 0.95 MM PITCH, PLASTIC, SSOP-5 | 0.65 MM PITCH, PLASTIC, SSOP-5 | - | - | 0.95 MM PITCH, PLASTIC, SSOP-5 |
针数 | 5 | 5 | - | - | 5 |
系列 | HC/UH | AHCT/VHCT/VT | - | - | AHCT/VHCT/VT |
JESD-609代码 | e0 | e2 | - | - | e2 |
长度 | 2.9 mm | 2 mm | - | - | 2.9 mm |
负载电容(CL) | 50 pF | - | 50 pF | 50 pF | - |
最大I(ol) | 0.008 A | - | 0.008 A | 0.008 A | - |
功能数量 | 1 | 1 | - | - | 1 |
输入次数 | 2 | 2 | - | - | 2 |
封装等效代码 | TSOP5/6,.11,37 | - | TSSOP5/6,.08 | TSOP5/6,.11,37 | - |
包装方法 | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL | - |
电源 | 5 V | - | 5 V | 5 V | - |
Prop。Delay @ Nom-Sup | 10.3 ns | - | 10.3 ns | 10.3 ns | - |
传播延迟(tpd) | 10.3 ns | 10.3 ns | - | - | 10.3 ns |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - |
施密特触发器 | NO | - | NO | NO | - |
座面最大高度 | 1.4 mm | 1.1 mm | - | - | 1.4 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | - | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | - | 4.5 V |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Silver (Sn/Ag) | - | - | Tin/Silver (Sn/Ag) |
宽度 | 1.6 mm | 1.25 mm | - | - | 1.6 mm |
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