
16-Bit Buffer/Driver With 3-State Outputs 54-BGA MICROSTAR JUNIOR -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | TFBGA, BGA54,6X9,32 |
| 针数 | 54 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 控制类型 | ENABLE LOW |
| 计数方向 | UNIDIRECTIONAL |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PBGA-B54 |
| JESD-609代码 | e1 |
| 长度 | 8 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I(ol) | 0.024 A |
| 湿度敏感等级 | 1 |
| 位数 | 4 |
| 功能数量 | 4 |
| 端口数量 | 2 |
| 端子数量 | 54 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFBGA |
| 封装等效代码 | BGA54,6X9,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 包装方法 | TR |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 3.3 V |
| 最大电源电流(ICC) | 0.02 mA |
| Prop。Delay @ Nom-Su | 4.1 ns |
| 传播延迟(tpd) | 6.6 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 翻译 | N/A |
| 宽度 | 5.5 mm |
| SN74LVCH16244AZRDR | SN74LVCH16244ADL | SN74LVCH16244ADLR | SN74LVCH16244AZQLR | SN74LVCH16244AGQLR | SN74LVCH16244ADGVR | 74LVCH16244ADGGRG4 | SN74LVCH16244ADLG4 | SN74LVCH16244AGRDR | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 16-Bit Buffer/Driver With 3-State Outputs 54-BGA MICROSTAR JUNIOR -40 to 85 | 16-Bit Buffer/Driver With 3-State Outputs 48-SSOP -40 to 125 | 16-Bit Buffer/Driver With 3-State Outputs 48-SSOP -40 to 125 | Buffers & Line Drivers 16-Bit Buffer/Driver With 3-State Outputs | Buffers & Line Drivers Tri-State 16-Bit | 16-Bit Buffer/Driver With 3-State Outputs 48-TVSOP -40 to 125 | 16-Bit Buffer/Driver With 3-State Outputs 48-TSSOP -40 to 125 | 16-Bit Buffer/Driver With 3-State Outputs 48-SSOP -40 to 125 | Buffers & Line Drivers 16B Buffer/Driver |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 | 符合 | 不符合 |
| 零件包装代码 | BGA | SSOP | SSOP | BGA | BGA | SOIC | TSSOP | SSOP | BGA |
| 包装说明 | TFBGA, BGA54,6X9,32 | SSOP, SSOP48,.4 | SSOP, SSOP48,.4 | VFBGA, BGA56,6X10,25 | VFBGA, BGA56,6X10,25 | TSSOP, TSSOP48,.25,16 | TSSOP, TSSOP48,.3,20 | SSOP, SSOP48,.4 | TFBGA, BGA54,6X9,32 |
| 针数 | 54 | 48 | 48 | 56 | 56 | 48 | 48 | 48 | 54 |
| Reach Compliance Code | compli | compli | compli | compli | _compli | compli | compli | compli | _compli |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week | 1 week | 1 week | 1 week | 6 weeks | 1 week |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PBGA-B54 | R-PDSO-G48 | R-PDSO-G48 | R-PBGA-B56 | R-PBGA-B56 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PBGA-B54 |
| JESD-609代码 | e1 | e4 | e4 | e1 | e0 | e4 | e4 | e4 | e0 |
| 长度 | 8 mm | 15.875 mm | 15.875 mm | 7 mm | 7 mm | 9.7 mm | 12.5 mm | 15.875 mm | 8 mm |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 54 | 48 | 48 | 56 | 56 | 48 | 48 | 48 | 54 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFBGA | SSOP | SSOP | VFBGA | VFBGA | TSSOP | TSSOP | SSOP | TFBGA |
| 封装等效代码 | BGA54,6X9,32 | SSOP48,.4 | SSOP48,.4 | BGA56,6X10,25 | BGA56,6X10,25 | TSSOP48,.25,16 | TSSOP48,.3,20 | SSOP48,.4 | BGA54,6X9,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 包装方法 | TR | TUBE | TR | TAPE AND REEL | TAPE AND REEL | TR | TR | TUBE | TAPE AND REEL |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 240 | 260 | 260 | 260 | 240 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | 4.1 ns | 4.1 ns | 4.1 ns | 4.1 ns | 4.1 ns | 4.1 ns | 4.1 ns | 4.1 ns | 4.1 ns |
| 传播延迟(tpd) | 6.6 ns | 6.6 ns | 6.6 ns | 6.6 ns | 6.6 ns | 6.6 ns | 6.6 ns | 6.6 ns | 6.6 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 2.79 mm | 2.79 mm | 1 mm | 1 mm | 1.2 mm | 1.2 mm | 2.79 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | GULL WING | GULL WING | BALL | BALL | GULL WING | GULL WING | GULL WING | BALL |
| 端子节距 | 0.8 mm | 0.635 mm | 0.635 mm | 0.65 mm | 0.65 mm | 0.4 mm | 0.5 mm | 0.635 mm | 0.8 mm |
| 端子位置 | BOTTOM | DUAL | DUAL | BOTTOM | BOTTOM | DUAL | DUAL | DUAL | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 5.5 mm | 7.49 mm | 7.49 mm | 4.5 mm | 4.5 mm | 4.4 mm | 6.1 mm | 7.49 mm | 5.5 mm |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | - | 不含铅 | 含铅 |
| 厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | - | EAR99 | EAR99 | - | - |
| 计数方向 | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | - | - | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | - |
| 最大电源电流(ICC) | 0.02 mA | 0.02 mA | 0.02 mA | - | - | 0.02 mA | - | 0.02 mA | - |
| 翻译 | N/A | N/A | N/A | - | - | N/A | N/A | N/A | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved