Digital Media System-on-Chip (DMSoC) 337-NFBGA 0 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | LFBGA, BGA337,19X19,25 |
| 针数 | 337 |
| Reach Compliance Code | compli |
| Factory Lead Time | 1 week |
| Samacsys Descripti | Digital Media System-on-Chi |
| 其他特性 | IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O |
| 位大小 | 32 |
| 总线兼容性 | I2C; SPI; UART; USB |
| 外部数据总线宽度 | 32 |
| 格式 | FIXED POINT |
| JESD-30 代码 | S-PBGA-B337 |
| JESD-609代码 | e1 |
| 长度 | 13 mm |
| 湿度敏感等级 | 3 |
| 端子数量 | 337 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装等效代码 | BGA337,19X19,25 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.3,1.8,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 8192 |
| 座面最大高度 | 1.3 mm |
| 最大供电电压 | 1.365 V |
| 最小供电电压 | 1.235 V |
| 标称供电电压 | 1.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.65 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 13 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT |
| TMS320DM355DZCE135 | TMS320DM355DZCE216 | TMS320DM355DZCE270 | DM355SDZCEA216 | TMS320DM355DZCEA21 | TMS320DM355CZCE216 | TMS320DM355CZCEA21 | TMS320DM355CZCEA13 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Digital Media System-on-Chip (DMSoC) 337-NFBGA 0 to 85 | Digital Media System-on-Chip (DMSoC) 337-NFBGA 0 to 85 | Digital Media System-on-Chip (DMSoC) 337-NFBGA 0 to 85 | Digital Media System-on-Chip (DMSoC) 337-NFBGA -40 to 100 | Digital Media System-on-Chip (DMSoC) 337-NFBGA -40 to 100 | Digital Media System-on-Chip (DMSoC) 337-NFBGA | Digital Media System-on-Chip (DMSoC) 337-NFBGA | Digital Signal Processors & Controllers - DSP, DSC Dig Media System-on- Chip |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | LFBGA, BGA337,19X19,25 | LFBGA, BGA337,19X19,25 | LFBGA, BGA337,19X19,25 | LFBGA, BGA337,19X19,25 | LFBGA, BGA337,19X19,25 | LFBGA, BGA337,19X19,25 | LFBGA, BGA337,19X19,25 | LFBGA, BGA337,19X19,25 |
| 针数 | 337 | 337 | 337 | 337 | 337 | 337 | 337 | 337 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | unknow |
| 其他特性 | IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O | IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O | IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O | IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O | IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O | IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O | IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O | IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| JESD-30 代码 | S-PBGA-B337 | S-PBGA-B337 | S-PBGA-B337 | S-PBGA-B337 | S-PBGA-B337 | S-PBGA-B337 | S-PBGA-B337 | S-PBGA-B337 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e1 |
| 长度 | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 337 | 337 | 337 | 337 | 337 | 337 | 337 | 337 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
| 封装等效代码 | BGA337,19X19,25 | BGA337,19X19,25 | BGA337,19X19,25 | BGA337,19X19,25 | BGA337,19X19,25 | BGA337,19X19,25 | BGA337,19X19,25 | BGA337,19X19,25 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 1.3,1.8,3.3 V | 1.3,1.8,3.3 V | 1.3,1.8,3.3 V | 1.3,1.8,3.3 V | 1.3,1.8,3.3 V | 1.3,1.8,3.3 V | 1.3,1.8,3.3 V | 1.3,1.8,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
| 座面最大高度 | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm |
| 最大供电电压 | 1.365 V | 1.365 V | 1.365 V | 1.365 V | 1.365 V | 1.365 V | 1.365 V | 1.365 V |
| 最小供电电压 | 1.235 V | 1.235 V | 1.235 V | 1.235 V | 1.235 V | 1.235 V | 1.235 V | 1.235 V |
| 标称供电电压 | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 含铅 |
| Factory Lead Time | 1 week | 6 weeks | 1 week | 6 weeks | 6 weeks | 1 week | 6 weeks | - |
| 总线兼容性 | I2C; SPI; UART; USB | I2C; SPI; UART; USB | I2C; SPI; UART; USB | I2C; SPI; UART; USB | I2C; SPI; UART; USB | I2C; SPI; UART; USB | I2C; SPI; UART; USB | - |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 100 °C | 100 °C | 85 °C | 100 °C | - |
| 温度等级 | OTHER | OTHER | OTHER | INDUSTRIAL | INDUSTRIAL | OTHER | INDUSTRIAL | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
