Flash Module, 512KX32, 90ns, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68
参数名称 | 属性值 |
厂商名称 | Cobham Semiconductor Solutions |
零件包装代码 | QFP |
包装说明 | 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 |
针数 | 68 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.2.C |
最长访问时间 | 90 ns |
其他特性 | USER CONFIGURABLE AS 2M X 8 |
备用内存宽度 | 16 |
JESD-30 代码 | S-CQFP-F68 |
长度 | 39.624 mm |
内存密度 | 16777216 bit |
内存集成电路类型 | FLASH MODULE |
内存宽度 | 32 |
功能数量 | 1 |
端子数量 | 68 |
字数 | 524288 words |
字数代码 | 512000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 512KX32 |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QFF |
封装形状 | SQUARE |
封装形式 | FLATPACK |
并行/串行 | PARALLEL |
编程电压 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 3.556 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | QUAD |
类型 | NOR TYPE |
宽度 | 39.624 mm |
ACT-F512K32N-090F1Q | ACT-F512K32N-150F1Q | ACT-F512K32N-070F1Q | ACT-F512K32N-120F1Q | |
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描述 | Flash Module, 512KX32, 90ns, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | Flash Module, 512KX32, 150ns, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | Flash Module, 512KX32, 70ns, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | Flash Module, 512KX32, 120ns, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 |
厂商名称 | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions |
零件包装代码 | QFP | QFP | QFP | QFP |
包装说明 | 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 | 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68 |
针数 | 68 | 68 | 68 | 68 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
最长访问时间 | 90 ns | 150 ns | 70 ns | 120 ns |
其他特性 | USER CONFIGURABLE AS 2M X 8 | USER CONFIGURABLE AS 2M X 8 | USER CONFIGURABLE AS 2M X 8 | USER CONFIGURABLE AS 2M X 8 |
备用内存宽度 | 16 | 16 | 16 | 16 |
JESD-30 代码 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 | S-CQFP-F68 |
长度 | 39.624 mm | 39.624 mm | 39.624 mm | 39.624 mm |
内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
内存集成电路类型 | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
内存宽度 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 68 | 68 | 68 | 68 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
组织 | 512KX32 | 512KX32 | 512KX32 | 512KX32 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QFF | QFF | QFF | QFF |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
编程电压 | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | FLAT | FLAT | FLAT |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
宽度 | 39.624 mm | 39.624 mm | 39.624 mm | 39.624 mm |
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