MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-TSSOP -40 to 85
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | TSSOP |
包装说明 | TSSOP-20 |
针数 | 20 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 1 week |
Samacsys Confidence | 3 |
Samacsys Status | Released |
Samacsys PartID | 278542 |
Samacsys Pin Count | 20 |
Samacsys Part Category | Integrated Circuit |
Samacsys Package Category | Small Outline Packages |
Samacsys Footprint Name | PW (R-PDSO-G20) |
Samacsys Released Date | 2016-02-19 11:06:00 |
Is Samacsys | N |
具有ADC | YES |
其他特性 | ALSO OPERATES AT 1.8V AT 6 MHZ |
地址总线宽度 | |
位大小 | 16 |
边界扫描 | YES |
CPU系列 | MSP430 |
最大时钟频率 | 16 MHz |
DAC 通道 | NO |
DMA 通道 | YES |
外部数据总线宽度 | |
格式 | FIXED POINT |
集成缓存 | NO |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e4 |
长度 | 6.5 mm |
低功率模式 | YES |
湿度敏感等级 | 1 |
DMA 通道数量 | 1 |
I/O 线路数量 | 16 |
串行 I/O 数 | 1 |
端子数量 | 20 |
计时器数量 | 2 |
片上数据RAM宽度 | 8 |
片上程序ROM宽度 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP20,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 2/3.3 V |
认证状态 | Not Qualified |
RAM(字节) | 512 |
RAM(字数) | 0.5 |
ROM(单词) | 16384 |
ROM可编程性 | FLASH |
座面最大高度 | 1.2 mm |
速度 | 16 MHz |
最大压摆率 | 0.42 mA |
最大供电电压 | 3.6 V |
最小供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4.4 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
Base Number Matches | 1 |
MSP430G2553IPW20 | MSP430G2353IPW20R | MSP430G2413IN20 | MSP430G2413IPW20 | MSP430G2413IPW20R | MSP430G2353IN20 | MSP430G2313IN20 | MSP430G2313IPW20 | |
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描述 | MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-TSSOP -40 to 85 | MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-TSSOP -40 to 85 | MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-PDIP -40 to 85 | MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-TSSOP -40 to 85 | MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-TSSOP -40 to 85 | MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-PDIP -40 to 85 | MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-PDIP -40 to 85 | MSP430G2x53, MSP430G2x13 Mixed Signal Microcontroller 20-TSSOP -40 to 85 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | TSSOP | TSSOP | DIP | TSSOP | TSSOP | DIP | DIP | TSSOP |
包装说明 | TSSOP-20 | TSSOP, TSSOP20,.25 | DIP, DIP20,.3 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | DIP-20 | DIP-20 | TSSOP, TSSOP20,.25 |
针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | compliant | compli | compli | compli | compli | compli | compliant | compli |
Factory Lead Time | 1 week | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 1 week | 6 weeks | 6 weeks |
具有ADC | YES | YES | YES | YES | NO | YES | YES | YES |
其他特性 | ALSO OPERATES AT 1.8V AT 6 MHZ | ALSO OPERATES AT 1.8V AT 6 MHZ | ALSO OPERATES AT 1.8V AT 6 MHZ | ALSO OPERATES AT 1.8V AT 6 MHZ | ALSO OPERATES AT 1.8V AT 6 MHZ | ALSO OPERATES AT 1.8V AT 6 MHZ | ALSO OPERATES AT 1.8V AT 6 MHZ | ALSO OPERATES AT 1.8V AT 6 MHZ |
位大小 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES |
CPU系列 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 |
最大时钟频率 | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
DMA 通道 | YES | YES | YES | YES | YES | YES | YES | YES |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
集成缓存 | NO | NO | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
长度 | 6.5 mm | 6.5 mm | 25.4 mm | 6.5 mm | 6.5 mm | 25.4 mm | 25.4 mm | 6.5 mm |
低功率模式 | YES | YES | YES | YES | YES | YES | YES | YES |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
DMA 通道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
I/O 线路数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
串行 I/O 数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
计时器数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
片上数据RAM宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
片上程序ROM宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | DIP | TSSOP | TSSOP | DIP | DIP | TSSOP |
封装等效代码 | TSSOP20,.25 | TSSOP20,.25 | DIP20,.3 | TSSOP20,.25 | TSSOP20,.25 | DIP20,.3 | DIP20,.3 | TSSOP20,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
电源 | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 512 | 256 | 512 | 512 | 512 | 256 | 256 | 256 |
RAM(字数) | 0.5 | 0.25 | 0.5 | 0.5 | 0.5 | 0.25 | 0.25 | 0.25 |
ROM(单词) | 16384 | 4096 | 8192 | 8192 | 8192 | 4096 | 4096 | 4096 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | 1.2 mm | 1.2 mm | 5.08 mm | 1.2 mm | 1.2 mm | 5.08 mm | 5.08 mm | 1.2 mm |
速度 | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
最大压摆率 | 0.42 mA | 0.42 mA | 0.42 mA | 0.42 mA | 0.42 mA | 0.42 mA | 0.42 mA | 0.42 mA |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 2.54 mm | 0.65 mm | 0.65 mm | 2.54 mm | 2.54 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 4.4 mm | 4.4 mm | 7.62 mm | 4.4 mm | 4.4 mm | 7.62 mm | 7.62 mm | 4.4 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
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