GT28F032B3BA90概述

Flash, 4MX8, 90ns, PBGA48, CSP, MICRO, BGA-48

GT28F032B3BA90规格参数

参数名称	属性值
零件包装代码	BGA
包装说明	CSP, MICRO, BGA-48
针数	48
Reach Compliance Code	unknow
ECCN代码	3A991.B.1.A
最长访问时间	90 ns
其他特性	MINIMUM 100K BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK
启动块	BOTTOM
JESD-30 代码	R-PBGA-B48
长度	10.85 mm
内存密度	33554432 bi
内存集成电路类型	FLASH
内存宽度	8
功能数量	1
端子数量	48
字数	4194304 words
字数代码	4000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	4MX8
封装主体材料	PLASTIC/EPOXY
封装代码	VFBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
编程电压	2.7 V
认证状态	Not Qualified
座面最大高度	1 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	BALL
端子节距	0.75 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
类型	NOR TYPE
宽度	7.286 mm
Base Number Matches	1

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GT28F032B3BA90相似产品对比

	GT28F032B3BA90	GT28F032B3TA110	GT28F032B3TA90	GT28F032B3BA110	TE28F320B3BA90	GT28F320B3BA90	GT28F320B3TA90	TE28F320B3TA90
描述	Flash, 4MX8, 90ns, PBGA48, CSP, MICRO, BGA-48	Flash, 4MX8, 110ns, PBGA48, CSP, MICRO, BGA-48	Flash, 4MX8, 90ns, PBGA48, CSP, MICRO, BGA-48	Flash, 4MX8, 110ns, PBGA48, CSP, MICRO, BGA-48	Flash, 2MX16, 90ns, PDSO48, 12 X 20 MM, TSOP-48	Flash, 2MX16, 90ns, PBGA48, CSP, MICRO, BGA-48	Flash, 2MX16, 90ns, PBGA48, CSP, MICRO, BGA-48	Flash, 2MX16, 90ns, PDSO48, 12 X 20 MM, TSOP-48
零件包装代码	BGA	BGA	BGA	BGA	TSOP	BGA	BGA	TSOP
包装说明	CSP, MICRO, BGA-48	CSP, MICRO, BGA-48	CSP, MICRO, BGA-48	CSP, MICRO, BGA-48	12 X 20 MM, TSOP-48	CSP, MICRO, BGA-48	CSP, MICRO, BGA-48	12 X 20 MM, TSOP-48
针数	48	48	48	48	48	48	48	48
Reach Compliance Code	unknow	unknow	unknow	unknow	unknown	unknown	unknown	unknown
ECCN代码	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
最长访问时间	90 ns	110 ns	90 ns	110 ns	90 ns	90 ns	90 ns	90 ns
其他特性	MINIMUM 100K BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK	MINIMUM 100K BLOCK ERASE CYCLES; TOP BOOT BLOCK	MINIMUM 100K BLOCK ERASE CYCLES; TOP BOOT BLOCK	MINIMUM 100K BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK	MINIMUM 100K BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK	MINIMUM 100K BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK	MINIMUM 100K BLOCK ERASE CYCLES; TOP BOOT BLOCK	MINIMUM 100K BLOCK ERASE CYCLES; TOP BOOT BLOCK
启动块	BOTTOM	TOP	TOP	BOTTOM	BOTTOM	BOTTOM	TOP	TOP
JESD-30 代码	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PDSO-G48	R-PBGA-B48	R-PBGA-B48	R-PDSO-G48
长度	10.85 mm	10.85 mm	10.85 mm	10.85 mm	18.4 mm	10.85 mm	10.85 mm	18.4 mm
内存密度	33554432 bi	33554432 bi	33554432 bi	33554432 bi	33554432 bit	33554432 bit	33554432 bit	33554432 bit
内存集成电路类型	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
内存宽度	8	8	8	8	16	16	16	16
功能数量	1	1	1	1	1	1	1	1
端子数量	48	48	48	48	48	48	48	48
字数	4194304 words	4194304 words	4194304 words	4194304 words	2097152 words	2097152 words	2097152 words	2097152 words
字数代码	4000000	4000000	4000000	4000000	2000000	2000000	2000000	2000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	4MX8	4MX8	4MX8	4MX8	2MX16	2MX16	2MX16	2MX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	VFBGA	VFBGA	VFBGA	VFBGA	TSOP1	VFBGA	VFBGA	TSOP1
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	240	240	NOT SPECIFIED
编程电压	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1 mm	1 mm	1 mm	1 mm	1.2 mm	1 mm	1 mm	1.2 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	BALL	BALL	BALL	BALL	GULL WING	BALL	BALL	GULL WING
端子节距	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.5 mm	0.75 mm	0.75 mm	0.5 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	DUAL	BOTTOM	BOTTOM	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	30	30	NOT SPECIFIED
类型	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
宽度	7.286 mm	7.286 mm	7.286 mm	7.286 mm	12 mm	7.286 mm	7.286 mm	12 mm
Base Number Matches	1	1	1	1	1	1	-	-

GT28F032B3BA90

GT28F032B3BA90概述

GT28F032B3BA90规格参数

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GT28F032B3BA90相似产品对比

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