Flash Module, 2MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Microsemi |
| 零件包装代码 | BGA |
| 包装说明 | BGA, |
| 针数 | 159 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.1.A |
| 最长访问时间 | 120 ns |
| 备用内存宽度 | 32 |
| JESD-30 代码 | R-PBGA-B159 |
| 内存密度 | 134217728 bit |
| 内存集成电路类型 | FLASH MODULE |
| 内存宽度 | 64 |
| 功能数量 | 1 |
| 端子数量 | 159 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2MX64 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 编程电压 | 3.3 V |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | BALL |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| W72M64V-120BC | W72M64V-120BI | W72M64V-100BC | W72M64V-120BM | W72M64V-150BC | W72M64V-150BM | W72M64V-100BI | W72M64V-150BI | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Flash Module, 2MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 100ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 150ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 150ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 100ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | Flash Module, 2MX64, 150ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | BGA, | BGA, | BGA, | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | BGA, | BGA, | BGA, | BGA, |
| 针数 | 159 | 159 | 159 | 159 | 159 | 159 | 159 | 159 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compli |
| ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A001.A.2.C | 3A991.B.1.A | 3A001.A.2.C | 3A991.B.1.A | EAR99 |
| 最长访问时间 | 120 ns | 120 ns | 100 ns | 120 ns | 150 ns | 150 ns | 100 ns | 150 ns |
| 备用内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| JESD-30 代码 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 |
| 内存密度 | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bi |
| 内存集成电路类型 | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
| 内存宽度 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 159 | 159 | 159 | 159 | 159 | 159 | 159 | 159 |
| 字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 125 °C | 70 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | - | -55 °C | - | -55 °C | -40 °C | -40 °C |
| 组织 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 编程电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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