REV
A
DESCRIPTION
NIR-63439
DATE
4/14/16
PREP
DF/SM
APPD
LT
Oscillator Specification, Hybrid VCXO
ACMOS, 9x14 mm, J-Lead
MOUNT HOLLY SPRINGS, PA 17065
THE RECORD OF APPROVAL FOR THIS
DOCUMENT IS MAINTAINED ELECTRONICALLY
WITHIN THE ERP SYSTEM
CODE IDENT NO
Hi-Rel Standard
SIZE
DWG. NO.
REV
00136
A
DOC206218
A
UNSPECIFIED TOLERANCES: N/A
SHEET 1 0F 18
1.
1.1
SCOPE
General. This specification defines the design, assembly and functional evaluation of high
reliability, VCXO’s produced by Vectron International. Devices delivered to this specification
represent the standardized Parts, Materials and Processes (PMP) Program developed,
implemented and certified for advanced applications and extended environments.
Applications Overview. The designs represented by these products were primarily developed
for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options
imbedded within DOC206218 bridge the gap between Space and COTS hardware by providing
custom hardware with measures of mechanical, assembly and reliability assurance needed for
Military or Ruggedized COTS environments.
APPLICABLE DOCUMENTS
Specifications and Standards. The following specifications and standards form a part of this
document to the extent specified herein. The issue currently in effect on the date of quotation
will be the product baseline, unless otherwise specified. In the event of conflict between the
texts of any references cited herein, the text of this document shall take precedence.
Military
MIL-PRF-55310
MIL-PRF-38534
Standards
MIL-STD-202
MIL-STD-883
Other
DOC206251
QSP-90100
DOC011627
DOC203982
QSP-91502
1.2
2.
2.1
Oscillators, Crystal Controlled, General Specification For
Hybrid Microcircuits, General Specification For
Test Method Standard, Electronic and Electrical Component Parts
Test Methods and Procedures for Microelectronics
Test Specification, DOC206218 Hybrids, Hi-Rel Standard
Quality Systems Manual, Vectron International
Identification Common Documents, Materials and Processes, Hi-Rel XO
DPA Specification
Procedure for Electrostatic Discharge Precautions
3.
3.1
GENERAL REQUIREMENTS
Classification. All devices delivered to this specification are of hybrid technology conforming
to Type 2, Class 2 of MIL-PRF-55310. Primarily developed as a Class S equivalent
specification, options are imbedded within it to also produce Class B, Engineering Model and
Ruggedized COTS devices. Devices carry a Class 2 ESDS classification per MIL-PRF-38534.
Item Identification. See paragraph 7.1 for part number configuration.
3.2
3.3
Absolute Maximum Ratings.
a. Supply Voltage Range (V
CC
):
UNSPECIFIED TOLERANCES
-0.5Vdc to +7.0Vdc
DWG NO.
REV.
SHEET
SIZE
CODE IDENT NO.
A
00136
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2
b. Storage Temperature Range (T
STG
):
c. Junction Temperature (T
J
):
d. Lead Temperature (soldering, 10 seconds):
e. Output Source/Sink Current:
3.4
3.4.1
-65°C to +125°C
+175°C
+300°C
±70 mA
Design, Parts, Materials and Processes, Assembly, Inspection and Test.
Design. The ruggedized designs implemented for these devices are proven in military and
space applications under extreme environments. The design utilizes a 4-point crystal mount in
compliment with Established Reliability (MIL-ER) componentry. When specified, radiation
hardening up to 100krad(Si) (RHA level R) can be included without altering the device’s
internal topography.
3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by reselecting
passive chip component values to offset component tolerances, there will not be fundamental
changes to the design or assembly or parts, materials and processes after first product delivery
of that item without written approval from the procuring activity.
3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of MIL-
PRF-55310.
3.4.2
Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high
reliability devices produced to this specification.
a. Gold metallization of package elements without a barrier metal.
b. Zinc chromate as a finish.
c. Cadmium, zinc, or pure tin external or internal to the device.
d. Plastic encapsulated semiconductor devices.
e. Ultrasonically cleaned electronic parts.
f. Heterojunction Bipolar Transistor (HBT) technology.
g. ‘getter’ materials
Assembly. Manufacturing utilizes standardized procedures, processes and verification
methods to produce MIL-PRF-55310 Class S / MIL-PRF-38534 Class K equivalent devices.
MIL-PRF-38534 Group B Option 1 in-line inspection is included on radiation hardened part
numbers to further verify lot pedigree. Traceability of all components and production lots are
in accordance with MIL-PRF-38534, as a minimum. Tabulated records are provided as a part
of the deliverable data package. Devices are handled in accordance with Vectron document
QSP-91502 (Procedure for Electrostatic Discharge Precautions).
Inspection. The inspection requirements of MIL-PRF-55310 apply to all devices delivered to
this document. Inspection conditions and standards are documented in accordance with the
Quality Assurance, ISO-9001 and AS9100 derived, System of QSP-90100.
Test. The Screening test matrix of Table 4 is tailored for selectable-combination testing to
eliminate costs associated with the development/maintenance of device-specific documentation
packages while maintaining performance integrity.
Marking. Device marking shall be in accordance with the requirements of MIL-PRF-55310.
UNSPECIFIED TOLERANCES
3.4.3
3.4.4
3.4.5
3.4.6
SIZE
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3.4.7
Ruggedized COTS Design Implementation. Design Pedigree “D” devices (see ¶ 5.2) use the
same robust designs found in the other device pedigrees. They do not include the provisions of
traceability or the Class-qualified componentry noted in paragraphs 3.4.3 and 4.1.
DETAIL REQUIREMENTS
Components
Crystals. Cultured quartz crystal resonators are used to provide the selected frequency for the
devices. The optional use of Premium Q swept quartz can, because of its processing to remove
impurities, be specified to minimize frequency drift when operating in radiation environments.
In accordance with MIL-PRF-55310, the manufacturer has a documented crystal element
evaluation program.
Passive Components. Passive components will have the same pedigree as the die specified in
paragraph 7.1. Lot evaluations are in accordance with MIL-PRF-38534 or Enhanced Element
Evaluation as specified in Table 7. When used, inductors may be open construction and may
use up to 47 gauge wire.
Class S Microcircuits. Devices are assembled with a varactor diode and an ACMOS chip
which are procured from wafer lots that have passed MIL-PRF-38534 Class K Lot Acceptance
Tests for Class S devices. The prescribed die carries a Class 2 ESDS classification in
accordance with MIL-PRF-38534. When optionally specified, further testing in accordance
with MIL-PRF-55310 and MIL-PRF-38534 is performed for radiation hardness assurance and
for Enhanced Element Evaluation as specified in Table 6. Those microcircuits, identified by a
unique part number, are certified for 100krad(Si) total ionizing dose (TID), RHA level R (2X
minimum margin). NSC, as the original 54ACT designer, rates the SEU LET at >40 MeV and
SEL at >120MeV for the FACT™ family (AN-932). Vectron has conducted additional SEE
testing in 2008 to verify this performance since our lot wafer testing does not include these
parameters and determinations. In addition, the varactor diode is considered insensitive to TID
and Single Event Effects.
4.
4.1
4.1.1
4.1.2
4.1.3
4.1.3.1 Class B Microcircuits. When specified, microcircuits assembled into OS-68338 Design
Pedigree letters “B” and “C” devices (¶ 5.2a) are procured from wafer lots that have passed
MIL-PRF-55310 element evaluations for Class B devices.
4.1.4
Packages. Packages are procured that meet the construction, lead materials and finishes as
specified in MIL-PRF-55310. Package lots are upscreened in accordance with the
requirements of MIL-PRF-38534 as applicable.
Traceability and Homogeneity. All design pedigrees except option D have active device lots
that are traceable to the manufacturer’s individual wafer; all other elements and materials are
traceable to their manufacturer and incoming inspection lots. Design pedigrees E, R, V and X
have homogeneous material. In addition, swept quartz crystals are traceable to the quartz bar
and the processing details of the autoclave lot, as applicable.
4.1.5
SIZE
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00136
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4
4.1.6
Enhanced Element Evaluation. When Design Pedigree Option “E” is specified, active and
passive devices with Enhanced Element Evaluation as listed in Table 5, 6 and 7 shall be
implemented for the highest reliability preference.
Mechanical.
Package Outline. See Figure 1.
Thermal Characteristics. The worst case thermal characteristics are found in Table 3.
Electrical.
Input Power. Devices are available with an input voltage of either +5.0 Vdc (±5%) or +3.3
Vdc (±5%). Current is measured, no load, at maximum rated operating voltage.
Temperature Range. Operating range is -40°C to +85°C.
Absolute Pull Range. Absolute pull range is defined as the minimum guaranteed amount the
VCXO can be varied about the center frequency (fo). It accounts for degradations including
temperature stability (-40°C to +85°C), aging (15 years), radiation effects, power supply
variations (±5%) and load variations (±10%).
Frequency Aging. When tested in accordance with MIL-PRF-55310 Group B inspection, the
15-year aging projection shall not cause the minimum APR limit to be exceeded.
Operating Characteristics. Symmetrical square wave limits are dependent on the device
frequency and are in accordance with Table 1. Waveform measurement points and logic limits
are in accordance with MIL-PRF-55310. Start-up time is 10.0 msec. maximum.
Output Load. ACMOS (10k , 15pF) test loads are in accordance with MIL-PRF-55310.
QUALITY ASSURANCE PROVISIONS AND VERIFICATION
Verification and Test. Device lots shall be tested prior to delivery in accordance with the
applicable Screening Option letter as stated by the 15
th
character of the part number. Table 4
tests are conducted in the order shown and annotated on the appropriate process travelers and
data sheets of the governing test procedure. For devices that require Screening Options that
include MIL-PRF-55310 Group A testing, the Post-Burn-In Electrical Test and the Group A
Electrical Test are combined into one operation.
Screening Options. The Screening Options, by letter, are summarized as:
A
Modified MIL-PRF-38534 Class K
B
Modified MIL-PRF-55310 Class B Screening & Group A Quality Conformance
Inspection (QCI)
C
Modified MIL-PRF-55310 Class S Screening & Group A QCI
D
Modified MIL-PRF-38534 Class K with Group B Aging
E
Modified MIL-PRF-55310 Class B Screening, Groups A & B QCI
4.2
4.2.1
4.2.2
4.3
4.3.1
4.3.2
4.3.3
4.3.4
4.3.5
4.3.6
5.
5.1
5.1.1
SIZE
CODE IDENT NO.
UNSPECIFIED TOLERANCES
DWG NO.
REV.
SHEET
A
00136
N/A
DOC206218
A
5
微控制器 MCU
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