16/32-Bit RISC Flash Microcontroller 144-LQFP -40 to 105
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | LQFP-144 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 6 weeks |
| Samacsys Description | MCU 32-bit ARM Cortex R4F RISC 2MB Flash 1.2V/3.3V 144-Pin LQFP |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 32 |
| 边界扫描 | YES |
| CPU系列 | CORTEX-R4F |
| 最大时钟频率 | 80 MHz |
| DAC 通道 | NO |
| DMA 通道 | YES |
| 外部数据总线宽度 | |
| 格式 | FLOATING POINT |
| 集成缓存 | NO |
| JESD-30 代码 | S-PQFP-G144 |
| JESD-609代码 | e4 |
| 长度 | 20 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 3 |
| DMA 通道数量 | 16 |
| 外部中断装置数量 | |
| I/O 线路数量 | 64 |
| 串行 I/O 数 | 7 |
| 端子数量 | 144 |
| 计时器数量 | 41 |
| 片上数据RAM宽度 | 8 |
| 片上程序ROM宽度 | 8 |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| RAM（字节） | 196608 |
| RAM（字数） | 192 |
| ROM（单词） | 2097152 |
| ROM可编程性 | FLASH |
| 座面最大高度 | 1.6 mm |
| 速度 | 200 MHz |
| 最大压摆率 | 400 mA |
| 最大供电电压 | 1.32 V |
| 最小供电电压 | 1.14 V |
| 标称供电电压 | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 宽度 | 20 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| Base Number Matches | 1 |
| RM48L540DPGET | RM48L940DPGET | RM48L940DZWTT | RM48L540DZWTT | RM48L740DPGET | RM48L740DZWTT | |
|---|---|---|---|---|---|---|
| 描述 | 16/32-Bit RISC Flash Microcontroller 144-LQFP -40 to 105 | 16/32-Bit RISC Flash Microcontroller 144-LQFP -40 to 105 | 16/32-Bit RISC Flash Microcontroller 337-NFBGA -40 to 105 | 16/32-Bit RISC Flash Microcontroller 337-NFBGA -40 to 105 | 16/32-Bit RISC Flash Microcontroller 144-LQFP -40 to 105 | 16/32-Bit RISC Flash Microcontroller 337-NFBGA -40 to 105 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | LQFP-144 | LFQFP, | LFBGA, | NFBGA-337 | LFQFP, | LFBGA, |
| Reach Compliance Code | compliant | compli | compli | compliant | compli | compli |
| Factory Lead Time | 6 weeks | 20 weeks | 6 weeks | 20 weeks | 20 weeks | 6 weeks |
| 具有ADC | YES | YES | YES | YES | YES | YES |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 |
| 最大时钟频率 | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO |
| DMA 通道 | YES | YES | YES | YES | YES | YES |
| JESD-30 代码 | S-PQFP-G144 | S-PQFP-G144 | S-PBGA-B337 | S-PBGA-B337 | S-PQFP-G144 | S-PBGA-B337 |
| JESD-609代码 | e4 | e4 | e1 | e1 | e4 | e1 |
| 长度 | 20 mm | 20 mm | 16 mm | 16 mm | 20 mm | 16 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| I/O 线路数量 | 64 | 64 | 144 | 144 | 64 | 144 |
| 端子数量 | 144 | 144 | 337 | 337 | 144 | 337 |
| 片上程序ROM宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LFQFP | LFBGA | LFBGA | LFQFP | LFBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| RAM（字节） | 196608 | 262144 | 262144 | 196608 | 262144 | 262144 |
| ROM（单词） | 2097152 | 3145728 | 3145728 | 2097152 | 2097152 | 2097152 |
| ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.4 mm | 1.4 mm | 1.6 mm | 1.4 mm |
| 速度 | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| 最大供电电压 | 1.32 V | 1.32 V | 1.32 V | 1.32 V | 1.32 V | 1.32 V |
| 最小供电电压 | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V |
| 标称供电电压 | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | GULL WING | GULL WING | BALL | BALL | GULL WING | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.5 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | BOTTOM | BOTTOM | QUAD | BOTTOM |
| 宽度 | 20 mm | 20 mm | 16 mm | 16 mm | 20 mm | 16 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| 厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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