EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | QCCN, LCC32,.45X.55 |
| Reach Compliance Code | unknow |
| 最长访问时间 | 200 ns |
| 命令用户界面 | NO |
| 数据轮询 | YES |
| JESD-30 代码 | R-XQCC-N32 |
| JESD-609代码 | e0 |
| 内存密度 | 65536 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 端子数量 | 32 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 8KX8 |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC32,.45X.55 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 页面大小 | 32 words |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.024 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 切换位 | NO |
| 最长写入周期时间 (tWC) | 10 ms |
| Base Number Matches | 1 |
| CAT28C64AL-20 | CAT28C64AD-25 | CAT28C64AP-12 | CAT28C64AL-12 | CAT28C64AJI-12 | CAT28C64AJ-12 | CAT28C64AD-15 | CAT28C64AJM-15 | CAT28C64AJM-20 | CAT28C64ANM-15 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32 | EEPROM, 8KX8, 250ns, Parallel, CMOS, CDIP28 | EEPROM, 8KX8, 120ns, Parallel, CMOS, PDIP28 | EEPROM, 8KX8, 120ns, Parallel, CMOS, CQCC32 | EEPROM, 8KX8, 120ns, Parallel, CMOS, PDSO28 | EEPROM, 8KX8, 120ns, Parallel, CMOS, PDSO28 | EEPROM, 8KX8, 150ns, Parallel, CMOS, CDIP28 | EEPROM, 8KX8, 150ns, Parallel, CMOS, PDSO28 | EEPROM, 8KX8, 200ns, Parallel, CMOS, PDSO28 | EEPROM, 8KX8, 150ns, Parallel, CMOS, PQCC32 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 200 ns | 250 ns | 120 ns | 120 ns | 120 ns | 120 ns | 150 ns | 150 ns | 200 ns | 150 ns |
| 命令用户界面 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 数据轮询 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| JESD-30 代码 | R-XQCC-N32 | R-XDIP-T28 | R-PDIP-T28 | R-XQCC-N32 | R-PDSO-G28 | R-PDSO-G28 | R-XDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PQCC-J32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 32 | 28 | 28 | 32 | 28 | 28 | 28 | 28 | 28 | 32 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCN | DIP | DIP | QCCN | SOP | SOP | DIP | SOP | SOP | QCCJ |
| 封装等效代码 | LCC32,.45X.55 | DIP28,.6 | DIP28,.6 | LCC32,.45X.55 | SOP28,.5 | SOP28,.5 | DIP28,.6 | SOP28,.5 | SOP28,.5 | LDCC32,.5X.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER |
| 页面大小 | 32 words | 32 words | 32 words | 32 words | 32 words | 32 words | 32 words | 32 words | 32 words | 32 words |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.024 mA | 0.0192 mA | 0.04 mA | 0.04 mA | 0.045 mA | 0.04 mA | 0.032 mA | 0.045 mA | 0.045 mA | 0.045 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| 切换位 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| 包装说明 | QCCN, LCC32,.45X.55 | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCN, LCC32,.45X.55 | SOP, SOP28,.5 | SOP, SOP28,.5 | DIP, DIP28,.6 | - | SOP, SOP28,.5 | - |
| 厂商名称 | - | - | - | - | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst |
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