Comparator, 1 Func, BIPolar, CDIP14,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| 放大器类型 | COMPARATOR |
| JESD-30 代码 | R-XDIP-T14 |
| JESD-609代码 | e0 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5,+-10 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class C |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| SE527F/883C | SE527H/883B | NE527F-B | SE527H/883C | SE527F-A | SE527F/883B | SE527NSIIA | |
|---|---|---|---|---|---|---|---|
| 描述 | Comparator, 1 Func, BIPolar, CDIP14, | Comparator, 1 Func, BIPolar, MBCY10, | Comparator, 1 Func, BIPolar, CDIP14, | Comparator, 1 Func, BIPolar, MBCY10, | Comparator, 1 Func, BIPolar, CDIP14, | Comparator, 1 Func, BIPolar, CDIP14, | Comparator, 1 Func, BIPolar, PDIP14, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| 放大器类型 | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR |
| JESD-30 代码 | R-XDIP-T14 | O-MBCY-W10 | R-XDIP-T14 | O-MBCY-W10 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 10 | 14 | 10 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | METAL | CERAMIC | METAL | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装等效代码 | DIP14,.3 | CAN10,.23 | DIP14,.3 | CAN10,.23 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | ROUND | RECTANGULAR | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CYLINDRICAL | IN-LINE | CYLINDRICAL | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5,+-10 V | 5,+-10 V | 5,+-10 V | 5,+-10 V | 5,+-10 V | 5,+-10 V | 5,+-10 V |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | WIRE | THROUGH-HOLE | WIRE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | BOTTOM | DUAL | BOTTOM | DUAL | DUAL | DUAL |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DIP, DIP14,.3 | - | DIP, DIP14,.3 | , CAN10,.23 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| 封装代码 | DIP | - | DIP | - | DIP | DIP | DIP |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 Class C | MIL-STD-883 Class B (Modified) | - | MIL-STD-883 Class C | - | MIL-STD-883 Class B (Modified) | - |
| 表面贴装 | NO | - | NO | - | NO | NO | NO |
| 端子节距 | 2.54 mm | - | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
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