Comparator, 1 Func, BIPolar, CDIP14,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DIP, DIP14,.3 |
Reach Compliance Code | unknown |
放大器类型 | COMPARATOR |
JESD-30 代码 | R-XDIP-T14 |
JESD-609代码 | e0 |
功能数量 | 1 |
端子数量 | 14 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5,+-10 V |
认证状态 | Not Qualified |
表面贴装 | NO |
技术 | BIPOLAR |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
SE527F-A | SE527H/883B | NE527F-B | SE527H/883C | SE527F/883B | SE527F/883C | SE527NSIIA | |
---|---|---|---|---|---|---|---|
描述 | Comparator, 1 Func, BIPolar, CDIP14, | Comparator, 1 Func, BIPolar, MBCY10, | Comparator, 1 Func, BIPolar, CDIP14, | Comparator, 1 Func, BIPolar, MBCY10, | Comparator, 1 Func, BIPolar, CDIP14, | Comparator, 1 Func, BIPolar, CDIP14, | Comparator, 1 Func, BIPolar, PDIP14, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
放大器类型 | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR |
JESD-30 代码 | R-XDIP-T14 | O-MBCY-W10 | R-XDIP-T14 | O-MBCY-W10 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 14 | 10 | 14 | 10 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC | METAL | CERAMIC | METAL | CERAMIC | CERAMIC | PLASTIC/EPOXY |
封装等效代码 | DIP14,.3 | CAN10,.23 | DIP14,.3 | CAN10,.23 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | ROUND | RECTANGULAR | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | CYLINDRICAL | IN-LINE | CYLINDRICAL | IN-LINE | IN-LINE | IN-LINE |
电源 | 5,+-10 V | 5,+-10 V | 5,+-10 V | 5,+-10 V | 5,+-10 V | 5,+-10 V | 5,+-10 V |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | WIRE | THROUGH-HOLE | WIRE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | BOTTOM | DUAL | BOTTOM | DUAL | DUAL | DUAL |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DIP, DIP14,.3 | - | DIP, DIP14,.3 | , CAN10,.23 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
封装代码 | DIP | - | DIP | - | DIP | DIP | DIP |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | - | NO | - | NO | NO | NO |
端子节距 | 2.54 mm | - | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
筛选级别 | - | MIL-STD-883 Class B (Modified) | - | MIL-STD-883 Class C | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class C | - |
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