Digital Signal Processors & Controllers - DSP, DSC System-Level
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | BGA |
| 包装说明 | LFBGA, BGA257,19X19,32 |
| 针数 | 257 |
| Reach Compliance Code | compli |
| ECCN代码 | 3A001.A.3 |
| Is Samacsys | N |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY |
| 地址总线宽度 | 23 |
| 桶式移位器 | NO |
| 位大小 | 16 |
| 边界扫描 | YES |
| 最大时钟频率 | 100 MHz |
| 外部数据总线宽度 | 32 |
| 格式 | FIXED POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B257 |
| JESD-609代码 | e1 |
| 长度 | 16 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 3 |
| 端子数量 | 257 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装等效代码 | BGA257,19X19,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.8,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 16384 |
| 座面最大高度 | 1.4 mm |
| 最大供电电压 | 1.95 V |
| 最小供电电压 | 1.71 V |
| 标称供电电压 | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 16 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, MIXED |
| Base Number Matches | 1 |
| TMS320VC5471ZHKA | TMS320VC5471GHK | TMS320VC5471GHKA | TMS320VC5471ZHK | TNETV1002IDZHK | |
|---|---|---|---|---|---|
| 描述 | Digital Signal Processors & Controllers - DSP, DSC System-Level | Digital Signal Processors & Controllers - DSP, DSC System-Level | Digital Signal Processors & Controllers - DSP, DSC System-Level | Digital Signal Processors & Controllers - DSP, DSC System-Level | Digital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Proc |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | LFBGA, BGA257,19X19,32 | LFBGA, BGA257,19X19,32 | LFBGA, BGA257,19X19,32 | LFBGA, BGA257,19X19,32 | LFBGA, BGA257,19X19,32 |
| 针数 | 257 | 257 | 257 | 257 | 257 |
| Reach Compliance Code | compli | _compli | _compli | compli | compli |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY | ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY | ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY | ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY | ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY |
| 地址总线宽度 | 23 | 23 | 23 | 23 | 23 |
| 桶式移位器 | NO | NO | NO | NO | NO |
| 位大小 | 16 | 16 | 16 | 16 | 16 |
| 边界扫描 | YES | YES | YES | YES | YES |
| 最大时钟频率 | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B257 | S-PBGA-B257 | S-PBGA-B257 | S-PBGA-B257 | S-PBGA-B257 |
| JESD-609代码 | e1 | e0 | e0 | e1 | e1 |
| 长度 | 16 mm | 16 mm | 16 mm | 16 mm | 16 mm |
| 低功率模式 | YES | YES | YES | YES | YES |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 257 | 257 | 257 | 257 | 257 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
| 封装等效代码 | BGA257,19X19,32 | BGA257,19X19,32 | BGA257,19X19,32 | BGA257,19X19,32 | BGA257,19X19,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 220 | 220 | 260 | 260 |
| 电源 | 1.8,3.3 V | 3.3 V | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 16384 | 16384 | 16384 | 16384 | 32768 |
| 座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
| 最大供电电压 | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V |
| 最小供电电压 | 1.71 V | 1.71 V | 1.71 V | 1.71 V | 1.71 V |
| 标称供电电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | OTHER | INDUSTRIAL | OTHER | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 16 mm | 16 mm | 16 mm | 16 mm | 16 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, MIXED | DIGITAL SIGNAL PROCESSOR, MIXED | DIGITAL SIGNAL PROCESSOR, MIXED | DIGITAL SIGNAL PROCESSOR, MIXED | DIGITAL SIGNAL PROCESSOR, MIXED |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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