|
TAS3103DBTRG4 |
TAS3103DBT |
TAS3103IDBT |
TAS3103DBTR |
TAS3103DBTG4 |
描述 |
Digital Audio Processor 38-TSSOP 0 to 70 |
Digital Audio Processor 38-TSSOP 0 to 70 |
Audio DSPs Digital Audio Processor |
Digital Audio Processor 38-TSSOP 0 to 70 |
Digital Audio Processor 38-TSSOP 0 to 70 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
零件包装代码 |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
包装说明 |
TSSOP, |
TSSOP, |
TSSOP, |
TSSOP, |
TSSOP, |
针数 |
38 |
38 |
38 |
38 |
38 |
Reach Compliance Code |
compli |
compli |
unknow |
compli |
compli |
JESD-30 代码 |
R-PDSO-G38 |
R-PDSO-G38 |
R-PDSO-G38 |
R-PDSO-G38 |
R-PDSO-G38 |
JESD-609代码 |
e4 |
e4 |
e4 |
e4 |
e4 |
长度 |
9.7 mm |
9.7 mm |
9.7 mm |
9.7 mm |
9.7 mm |
湿度敏感等级 |
2 |
2 |
2 |
2 |
2 |
端子数量 |
38 |
38 |
38 |
38 |
38 |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) |
260 |
260 |
NOT SPECIFIED |
260 |
260 |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
端子节距 |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
4.4 mm |
4.4 mm |
4.4 mm |
4.4 mm |
4.4 mm |
uPs/uCs/外围集成电路类型 |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
Factory Lead Time |
1 week |
1 week |
1 week |
1 week |
- |
桶式移位器 |
NO |
NO |
- |
NO |
NO |
边界扫描 |
NO |
NO |
- |
NO |
NO |
最大时钟频率 |
20 MHz |
20 MHz |
- |
20 MHz |
20 MHz |
格式 |
FIXED POINT |
FIXED POINT |
- |
FIXED POINT |
FIXED POINT |
内部总线架构 |
MULTIPLE |
MULTIPLE |
- |
MULTIPLE |
MULTIPLE |
低功率模式 |
YES |
YES |
- |
YES |
YES |
最高工作温度 |
70 °C |
70 °C |
- |
70 °C |
70 °C |
最大供电电压 |
3.6 V |
3.6 V |
- |
3.6 V |
3.6 V |
最小供电电压 |
3 V |
3 V |
- |
3 V |
3 V |
标称供电电压 |
3.3 V |
3.3 V |
- |
3.3 V |
3.3 V |
是否无铅 |
- |
不含铅 |
含铅 |
不含铅 |
- |