WiLink 8 single band Wi-Fi® module 100-QFM -20 to 70
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
包装说明 | LGA, LGA100(UNSPEC) |
Reach Compliance Code | compliant |
ECCN代码 | 5A992.C |
Is Samacsys | N |
数据速率 | 100000 Mbps |
JESD-30 代码 | R-PBGA-N100 |
JESD-609代码 | e4 |
长度 | 13.4 mm |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 100 |
最高工作温度 | 70 °C |
最低工作温度 | -20 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LGA |
封装等效代码 | LGA100(UNSPEC) |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY |
峰值回流温度(摄氏度) | 260 |
电源 | 2.9/4.8 V |
认证状态 | Not Qualified |
座面最大高度 | 2 mm |
标称供电电压 | 3.7 V |
表面贴装 | YES |
电信集成电路类型 | TELECOM CIRCUIT |
温度等级 | OTHER |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD |
端子节距 | 0.7 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 13.3 mm |
Base Number Matches | 1 |
WL1801MODGBMOCT | WL1835MODGBMOCT | WL1835MODGBMOCR | WL1801MODGBMOCR | WL1805MODGBMOCR | WL1805MODGBMOCT | WL1831MODGBMOCR | WL1831MODGBMOCT | |
---|---|---|---|---|---|---|---|---|
描述 | WiLink 8 single band Wi-Fi® module 100-QFM -20 to 70 | WiLink 8 single band combo 2x2 MIMO Wi-Fi®, Bluetooth® & Bluetooth Smart module 100-QFM -20 to 70 | WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM | WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin LGA Module | WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM | WiLink 8 single band, 2x2 MIMO Wi-Fi® module 100-QFM -20 to 70 | WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) + EDR 100-Pin QFM | WiLink 8 industrial Wi-Fi, Bluetooth & Bluetooth Smart (Low energy) module 100-QFM -20 to 70 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - | 符合 | 符合 | 符合 |
包装说明 | LGA, LGA100(UNSPEC) | MOC-100 | MOC-100 | MOC-100 | - | MOC-100 | MOC-100 | MOC-100 |
Reach Compliance Code | compliant | compliant | compliant | compliant | - | compliant | compliant | compliant |
Is Samacsys | N | N | N | N | - | N | N | N |
数据速率 | 100000 Mbps | 100000 Mbps | 100000 Mbps | 100000 Mbps | - | 100000 Mbps | 100000 Mbps | 100000 Mbps |
JESD-30 代码 | R-PBGA-N100 | R-PBGA-N100 | R-PBGA-N100 | R-PBGA-N100 | - | R-PBGA-N100 | R-PBGA-N100 | R-PBGA-N100 |
JESD-609代码 | e4 | e4 | e4 | e4 | - | e4 | e4 | e4 |
长度 | 13.4 mm | 13.4 mm | 13.4 mm | 13.4 mm | - | 13.4 mm | 13.4 mm | 13.4 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | - | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 |
端子数量 | 100 | 100 | 100 | 100 | - | 100 | 100 | 100 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | - | 70 °C | 70 °C | 70 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | - | -20 °C | -20 °C | -20 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LGA | LGA | LGA | LGA | - | LGA | LGA | LGA |
封装等效代码 | LGA100(UNSPEC) | LGA100(UNSPEC) | LGA100(UNSPEC) | LGA100(UNSPEC) | - | LGA100(UNSPEC) | LGA100(UNSPEC) | LGA100(UNSPEC) |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | - | GRID ARRAY | GRID ARRAY | GRID ARRAY |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | - | 260 | 260 | 260 |
电源 | 2.9/4.8 V | 2.9/4.8 V | 2.9/4.8 V | 2.9/4.8 V | - | 2.9/4.8 V | 2.9/4.8 V | 2.9/4.8 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2 mm | 2 mm | 2 mm | 2 mm | - | 2 mm | 2 mm | 2 mm |
标称供电电压 | 3.7 V | 3.7 V | 3.7 V | 3.7 V | - | 3.7 V | 3.7 V | 3.7 V |
表面贴装 | YES | YES | YES | YES | - | YES | YES | YES |
电信集成电路类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | - | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
温度等级 | OTHER | OTHER | OTHER | OTHER | - | OTHER | OTHER | OTHER |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.7 mm | 0.7 mm | 0.7 mm | 0.7 mm | - | 0.7 mm | 0.7 mm | 0.7 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 13.3 mm | 13.3 mm | 13.3 mm | 13.3 mm | - | 13.3 mm | 13.3 mm | 13.3 mm |
Base Number Matches | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 |
厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
Factory Lead Time | - | 12 weeks | 16 weeks | 12 weeks | - | 12 weeks | 26 weeks | 12 weeks |
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