电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索
 PDF数据手册

TMS320C6670AXCYPA2

产品描述Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA -40 to 100
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小2MB,共225页
制造商Texas Instruments(德州仪器)
官网地址http://www.ti.com.cn/
标准
敬请期待 详细参数 选型对比

TMS320C6670AXCYPA2在线购买

供应商 器件名称 价格 最低购买 库存  
TMS320C6670AXCYPA2 - - 点击查看 点击购买

TMS320C6670AXCYPA2概述

Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA -40 to 100

TMS320C6670AXCYPA2规格参数

参数名称属性值
Brand NameTexas Instruments
是否无铅不含铅
是否Rohs认证符合
厂商名称Texas Instruments(德州仪器)
零件包装代码BGA
包装说明FCBGA-841
针数841
Reach Compliance Codecompliant
桶式移位器NO
位大小32
边界扫描YES
格式FLOATING POINT
集成缓存YES
内部总线架构SINGLE
JESD-30 代码S-PBGA-B841
JESD-609代码e1
长度24 mm
低功率模式YES
湿度敏感等级4
DMA 通道数量80
端子数量841
计时器数量16
最高工作温度100 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码FBGA
封装等效代码BGA841,29X29,32
封装形状SQUARE
封装形式GRID ARRAY, FINE PITCH
峰值回流温度(摄氏度)245
电源1,1.5,1.8 V
认证状态Not Qualified
RAM(字数)32768
座面最大高度3.39 mm
最大供电电压1.05 V
最小供电电压0.95 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度24 mm
uPs/uCs/外围集成电路类型DIGITAL SIGNAL PROCESSOR, MIXED
Base Number Matches1

TMS320C6670AXCYPA2相似产品对比

TMS320C6670AXCYPA2 TMX320C6670CYP TMS320C6670CYPA2 TMS320C6670XCYPA TMS320C6670XCYPA2 TMS320C6670AXCYP TMS320C6670ACYP2 TMS320C6670AXCYP2 TMS320C6670AXCYPA TMS320C6670ACYPA
描述 Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA -40 to 100 Digital Signal Processors & Controllers - DSP, DSC Multicore Fixed & Floating-Point SOC Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA -40 to 100 Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA -40 to 100 Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA -40 to 100 Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA 0 to 85 Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA 0 to 85 Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA 0 to 85 Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA -40 to 100 Multicore Fixed and Floating-Point System-on-Chip 841-FCBGA -40 to 100
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
零件包装代码 BGA BGA BGA BGA BGA BGA BGA BGA BGA BGA
包装说明 FCBGA-841 FBGA, BGA841,29X29,32 FBGA, BGA841,29X29,32 FBGA, BGA841,29X29,32 FBGA, BGA841,29X29,32 FBGA, BGA841,29X29,32 FBGA, BGA841,29X29,32 FCBGA-841 FBGA, BGA841,29X29,32 FCBGA-841
针数 841 841 841 841 841 841 841 841 841 841
Reach Compliance Code compliant unknow compli compli compli compli compli compliant compli compliant
桶式移位器 NO NO YES YES YES NO NO NO NO NO
位大小 32 32 32 32 32 32 32 32 32 32
边界扫描 YES YES YES YES YES YES YES YES YES YES
格式 FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
内部总线架构 SINGLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE SINGLE SINGLE SINGLE SINGLE SINGLE
JESD-30 代码 S-PBGA-B841 S-PBGA-B841 S-PBGA-B841 S-PBGA-B841 S-PBGA-B841 S-PBGA-B841 S-PBGA-B841 S-PBGA-B841 S-PBGA-B841 S-PBGA-B841
长度 24 mm 24 mm 24 mm 24 mm 24 mm 24 mm 24 mm 24 mm 24 mm 24 mm
低功率模式 YES YES YES YES YES YES YES YES YES YES
端子数量 841 841 841 841 841 841 841 841 841 841
最高工作温度 100 °C 85 °C 100 °C 100 °C 100 °C 85 °C 85 °C 85 °C 100 °C 100 °C
最低工作温度 -40 °C - -40 °C -40 °C -40 °C - - - -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA
封装等效代码 BGA841,29X29,32 BGA841,29X29,32 BGA841,29X29,32 BGA841,29X29,32 BGA841,29X29,32 BGA841,29X29,32 BGA841,29X29,32 BGA841,29X29,32 BGA841,29X29,32 BGA841,29X29,32
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
电源 1,1.5,1.8 V 1,1.5,1.8 V 1,1.5,1.8 V 1,1.5,1.8 V 1,1.5,1.8 V 1,1.5,1.8 V 1,1.5,1.8 V 1,1.5,1.8 V 1,1.5,1.8 V 1,1.5,1.8 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM(字数) 32768 32768 32768 32768 32768 32768 32768 32768 32768 32768
座面最大高度 3.39 mm 3.39 mm 3.39 mm 3.39 mm 3.39 mm 3.39 mm 3.39 mm 3.39 mm 3.39 mm 3.39 mm
最大供电电压 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V 1.05 V
最小供电电压 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V 0.95 V
标称供电电压 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL OTHER INDUSTRIAL INDUSTRIAL INDUSTRIAL OTHER OTHER OTHER INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL BALL BALL
端子节距 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
宽度 24 mm 24 mm 24 mm 24 mm 24 mm 24 mm 24 mm 24 mm 24 mm 24 mm
uPs/uCs/外围集成电路类型 DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED
是否无铅 不含铅 含铅 - - - 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 - 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 Texas Instruments(德州仪器) - Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器)
集成缓存 YES - YES YES YES YES YES YES YES YES
JESD-609代码 e1 - e1 e1 e1 e1 e1 e1 e1 e1
湿度敏感等级 4 - 4 4 4 4 4 4 4 4
DMA 通道数量 80 - 80 80 80 80 80 80 80 80
计时器数量 16 - 16 16 16 16 16 16 16 16
峰值回流温度(摄氏度) 245 - 245 245 245 245 245 245 245 -
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 国产芯 大学堂 TI培训 Datasheet 电子工程 索引文件: 236  864  1118  1332  1487 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved