16KX4 PAGE MODE DRAM, 120ns, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | DIP |
包装说明 | DIP, DIP18,.3 |
针数 | 18 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
访问模式 | PAGE |
最长访问时间 | 120 ns |
其他特性 | RAS ONLY REFRESH |
I/O 类型 | COMMON |
JESD-30 代码 | R-CDIP-T18 |
长度 | 22.606 mm |
内存密度 | 65536 bit |
内存集成电路类型 | PAGE MODE DRAM |
内存宽度 | 4 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 18 |
字数 | 16384 words |
字数代码 | 16000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 100 °C |
最低工作温度 | -55 °C |
组织 | 16KX4 |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装等效代码 | DIP18,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
刷新周期 | 256 |
筛选级别 | 38535Q/M;38534H;883B |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | NMOS |
温度等级 | OTHER |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
SMJ4416-12JDS | SMJ4416-15JDL | SMJ4416-15JDS | SMJ4416-20JDS | SMJ4416-20JDL | SMJ4416-12JDL | |
---|---|---|---|---|---|---|
描述 | 16KX4 PAGE MODE DRAM, 120ns, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18 | 16KX4 PAGE MODE DRAM, 150ns, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18 | 16KX4 PAGE MODE DRAM, 150ns, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18 | 16KX4 PAGE MODE DRAM, 200ns, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18 | 16KX4 PAGE MODE DRAM, 200ns, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18 | 16KX4 PAGE MODE DRAM, 120ns, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18 |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
包装说明 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, | DIP, |
针数 | 18 | 18 | 18 | 18 | 18 | 18 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | PAGE | PAGE | PAGE | PAGE | PAGE | PAGE |
最长访问时间 | 120 ns | 150 ns | 150 ns | 200 ns | 200 ns | 120 ns |
其他特性 | RAS ONLY REFRESH | RAS ONLY REFRESH | RAS ONLY REFRESH | RAS ONLY REFRESH | RAS ONLY REFRESH | RAS ONLY REFRESH |
JESD-30 代码 | R-CDIP-T18 | R-CDIP-T18 | R-CDIP-T18 | R-CDIP-T18 | R-CDIP-T18 | R-CDIP-T18 |
长度 | 22.606 mm | 22.606 mm | 22.606 mm | 22.606 mm | 22.606 mm | 22.606 mm |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
内存集成电路类型 | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 18 | 18 | 18 | 18 | 18 | 18 |
字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 100 °C | 70 °C | 100 °C | 100 °C | 70 °C | 70 °C |
组织 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 256 | 256 | 256 | 256 | 256 | 256 |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS |
温度等级 | OTHER | COMMERCIAL | OTHER | OTHER | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | - |
厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | - | - |
封装等效代码 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 | - | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
电源 | 5 V | 5 V | 5 V | 5 V | - | - |
筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
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