128K X 8 STANDARD SRAM, 70 ns, PDSO32
参数名称 | 属性值 |
功能数量 | 1 |
端子数量 | 32 |
最大工作温度 | 70 Cel |
最小工作温度 | 0.0 Cel |
最大供电/工作电压 | 5.5 V |
最小供电/工作电压 | 4.5 V |
额定供电电压 | 5 V |
最大存取时间 | 70 ns |
加工封装描述 | 0.450 INCH, PLASTIC, SOP-32 |
状态 | DISCONTINUED |
工艺 | CMOS |
包装形状 | RECTANGULAR |
包装尺寸 | SMALL OUTLINE |
表面贴装 | Yes |
端子形式 | GULL WING |
端子间距 | 1.27 mm |
端子涂层 | TIN LEAD |
端子位置 | DUAL |
包装材料 | PLASTIC/EPOXY |
温度等级 | COMMERCIAL |
内存宽度 | 8 |
组织 | 128K X 8 |
存储密度 | 1.05E6 deg |
操作模式 | ASYNCHRONOUS |
位数 | 131072 words |
位数 | 128K |
内存IC类型 | STANDARD SRAM |
串行并行 | PARALLEL |
IS62C1024L-35TI | 62C1024L | IS62C1024L | IS62C1024L-35Q | IS62C1024L-35QI | IS62C1024L-35T | IS62C1024L-70Q | IS62C1024L-70QI | 1202530098 | 1200908037 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | 128K X 8 STANDARD SRAM, 70 ns, PDSO32 | 128K X 8 STANDARD SRAM, 70 ns, PDSO32 | 128K X 8 STANDARD SRAM, 70 ns, PDSO32 | 128K X 8 STANDARD SRAM, 70 ns, PDSO32 | 128K X 8 STANDARD SRAM, 70 ns, PDSO32 | 128K X 8 STANDARD SRAM, 70 ns, PDSO32 | 128K X 8 STANDARD SRAM, 70 ns, PDSO32 | 128K X 8 STANDARD SRAM, 70 ns, PDSO32 | Contrinex Inductive Sensor, M12 Housing, 6mm Operating Distance, Quasiembeddable | Nano-Change (M8) Receptacle, M8 x 0.5 Mounting Threads, Female |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | - | - |
最大工作温度 | 70 Cel | 70 Cel | 70 Cel | 70 Cel | 70 Cel | 70 Cel | - | - | - | - |
最小工作温度 | 0.0 Cel | 0.0 Cel | 0.0 Cel | 0.0 Cel | 0.0 Cel | 0.0 Cel | - | - | - | - |
最大供电/工作电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - | - | - |
最小供电/工作电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - | - | - |
额定供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | - | - |
最大存取时间 | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | - | - | - | - |
加工封装描述 | 0.450 INCH, PLASTIC, SOP-32 | 0.450 INCH, PLASTIC, SOP-32 | 0.450 INCH, PLASTIC, SOP-32 | 0.450 INCH, PLASTIC, SOP-32 | 0.450 INCH, PLASTIC, SOP-32 | 0.450 INCH, PLASTIC, SOP-32 | - | - | - | - |
状态 | DISCONTINUED | DISCONTINUED | DISCONTINUED | DISCONTINUED | DISCONTINUED | DISCONTINUED | - | - | - | - |
工艺 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | - | - |
包装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - | - |
包装尺寸 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | - | - | - |
表面贴装 | Yes | Yes | Yes | Yes | Yes | Yes | YES | YES | - | - |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - | - |
端子间距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | - | - | - |
端子涂层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - | - | - | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | - |
包装材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - | - |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | - | - |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | - |
组织 | 128K X 8 | 128K X 8 | 128K X 8 | 128K X 8 | 128K X 8 | 128K X 8 | 128KX8 | 128KX8 | - | - |
存储密度 | 1.05E6 deg | 1.05E6 deg | 1.05E6 deg | 1.05E6 deg | 1.05E6 deg | 1.05E6 deg | - | - | - | - |
操作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | - | - | - |
位数 | 128K | 128K | 128K | 128K | 128K | 128K | - | - | - | - |
内存IC类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | - | - | - | - |
串行并行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | - | - | - |
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