QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16(UNSPEC) |
| 针数 | 16 |
| Reach Compliance Code | unknow |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e0 |
| 负电源电压最大值（Vsup） | -6 V |
| 负电源电压最小值（Vsup） | -1.5 V |
| 标称负供电电压 (Vsup) | -5 V |
| 正常位置 | NO |
| 信道数量 | 1 |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 标称断态隔离度 | 75 dB |
| 通态电阻匹配规范 | 1.8 Ω |
| 最大通态电阻 (Ron) | 135 Ω |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16(UNSPEC) |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | +-1.5/+-6/3/12 V |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 1.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 最长断开时间 | 180 ns |
| 最长接通时间 | 110 ns |
| 切换 | MAKE-BEFORE-BREAK |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |
| ALD4202MPC | ALD4201SC | ALD4202M | ALD4202MSC | ALD4201 | ALD4201DC | ALD4201PC | ALD4202MDC | |
|---|---|---|---|---|---|---|---|---|
| 描述 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16 |
| 是否无铅 | 含铅 | 含铅 | - | 含铅 | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | SOIC | - | SOIC | - | DIP | DIP | DIP |
| 包装说明 | DIP, DIP16(UNSPEC) | SOP, SOP16(UNSPEC) | - | SOP, SOP16(UNSPEC) | - | DIP, DIP16(UNSPEC) | DIP, DIP16(UNSPEC) | DIP, DIP16(UNSPEC) |
| 针数 | 16 | 16 | - | 16 | - | 16 | 16 | 16 |
| Reach Compliance Code | unknow | unknow | - | unknow | - | unknow | unknow | unknow |
| 模拟集成电路 - 其他类型 | SPST | SPST | - | SPST | - | SPST | SPST | SPST |
| JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | - | R-PDSO-G16 | - | R-GDIP-T16 | R-PDIP-T16 | R-GDIP-T16 |
| JESD-609代码 | e0 | e0 | - | e0 | - | e0 | e0 | e0 |
| 负电源电压最大值（Vsup） | -6 V | -6 V | - | -6 V | - | -6 V | -6 V | -6 V |
| 负电源电压最小值（Vsup） | -1.5 V | -1.5 V | - | -1.5 V | - | -1.5 V | -1.5 V | -1.5 V |
| 标称负供电电压 (Vsup) | -5 V | -5 V | - | -5 V | - | -5 V | -5 V | -5 V |
| 正常位置 | NO | NC | - | NO | - | NC | NC | NO |
| 信道数量 | 1 | 1 | - | 1 | - | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | - | 4 | - | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | - | 16 | - | 16 | 16 | 16 |
| 标称断态隔离度 | 75 dB | 75 dB | - | 75 dB | - | 75 dB | 75 dB | 75 dB |
| 通态电阻匹配规范 | 1.8 Ω | 1.8 Ω | - | 1.8 Ω | - | 1.8 Ω | 1.8 Ω | 1.8 Ω |
| 最大通态电阻 (Ron) | 135 Ω | 135 Ω | - | 135 Ω | - | 135 Ω | 135 Ω | 135 Ω |
| 最高工作温度 | 70 °C | 70 °C | - | 70 °C | - | 125 °C | 70 °C | 125 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | SOP | - | SOP | - | DIP | DIP | DIP |
| 封装等效代码 | DIP16(UNSPEC) | SOP16(UNSPEC) | - | SOP16(UNSPEC) | - | DIP16(UNSPEC) | DIP16(UNSPEC) | DIP16(UNSPEC) |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | - | SMALL OUTLINE | - | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | +-1.5/+-6/3/12 V | +-1.5/+-6/3/12 V | - | +-1.5/+-6/3/12 V | - | +-1.5/+-6/3/12 V | +-1.5/+-6/3/12 V | +-1.5/+-6/3/12 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 6 V | 6 V | - | 6 V | - | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 1.5 V | 1.5 V | - | 1.5 V | - | 1.5 V | 1.5 V | 1.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | - | YES | - | NO | NO | NO |
| 最长断开时间 | 180 ns | 130 ns | - | 180 ns | - | 130 ns | 130 ns | 180 ns |
| 最长接通时间 | 110 ns | 240 ns | - | 110 ns | - | 240 ns | 240 ns | 110 ns |
| 切换 | MAKE-BEFORE-BREAK | BREAK-BEFORE-MAKE | - | MAKE-BEFORE-BREAK | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | MAKE-BEFORE-BREAK |
| 技术 | CMOS | CMOS | - | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | - | MILITARY | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | - | GULL WING | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | - | DUAL | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | - | 1 | - | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
