QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | SOIC |
包装说明 | SOP, SOP16(UNSPEC) |
针数 | 16 |
Reach Compliance Code | unknow |
模拟集成电路 - 其他类型 | SPST |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e0 |
负电源电压最大值(Vsup) | -6 V |
负电源电压最小值(Vsup) | -1.5 V |
标称负供电电压 (Vsup) | -5 V |
正常位置 | NO |
信道数量 | 1 |
功能数量 | 4 |
端子数量 | 16 |
标称断态隔离度 | 75 dB |
通态电阻匹配规范 | 1.8 Ω |
最大通态电阻 (Ron) | 135 Ω |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP16(UNSPEC) |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | +-1.5/+-6/3/12 V |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 1.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
最长断开时间 | 180 ns |
最长接通时间 | 110 ns |
切换 | MAKE-BEFORE-BREAK |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
Base Number Matches | 1 |
ALD4202MSC | ALD4201SC | ALD4202M | ALD4201 | ALD4201DC | ALD4201PC | ALD4202MDC | ALD4202MPC | |
---|---|---|---|---|---|---|---|---|
描述 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16 | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 |
是否无铅 | 含铅 | 含铅 | - | - | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | SOIC | SOIC | - | - | DIP | DIP | DIP | DIP |
包装说明 | SOP, SOP16(UNSPEC) | SOP, SOP16(UNSPEC) | - | - | DIP, DIP16(UNSPEC) | DIP, DIP16(UNSPEC) | DIP, DIP16(UNSPEC) | DIP, DIP16(UNSPEC) |
针数 | 16 | 16 | - | - | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknow | unknow | - | - | unknow | unknow | unknow | unknow |
模拟集成电路 - 其他类型 | SPST | SPST | - | - | SPST | SPST | SPST | SPST |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | - | - | R-GDIP-T16 | R-PDIP-T16 | R-GDIP-T16 | R-PDIP-T16 |
JESD-609代码 | e0 | e0 | - | - | e0 | e0 | e0 | e0 |
负电源电压最大值(Vsup) | -6 V | -6 V | - | - | -6 V | -6 V | -6 V | -6 V |
负电源电压最小值(Vsup) | -1.5 V | -1.5 V | - | - | -1.5 V | -1.5 V | -1.5 V | -1.5 V |
标称负供电电压 (Vsup) | -5 V | -5 V | - | - | -5 V | -5 V | -5 V | -5 V |
正常位置 | NO | NC | - | - | NC | NC | NO | NO |
信道数量 | 1 | 1 | - | - | 1 | 1 | 1 | 1 |
功能数量 | 4 | 4 | - | - | 4 | 4 | 4 | 4 |
端子数量 | 16 | 16 | - | - | 16 | 16 | 16 | 16 |
标称断态隔离度 | 75 dB | 75 dB | - | - | 75 dB | 75 dB | 75 dB | 75 dB |
通态电阻匹配规范 | 1.8 Ω | 1.8 Ω | - | - | 1.8 Ω | 1.8 Ω | 1.8 Ω | 1.8 Ω |
最大通态电阻 (Ron) | 135 Ω | 135 Ω | - | - | 135 Ω | 135 Ω | 135 Ω | 135 Ω |
最高工作温度 | 70 °C | 70 °C | - | - | 125 °C | 70 °C | 125 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | SOP | SOP | - | - | DIP | DIP | DIP | DIP |
封装等效代码 | SOP16(UNSPEC) | SOP16(UNSPEC) | - | - | DIP16(UNSPEC) | DIP16(UNSPEC) | DIP16(UNSPEC) | DIP16(UNSPEC) |
封装形状 | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | - | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | +-1.5/+-6/3/12 V | +-1.5/+-6/3/12 V | - | - | +-1.5/+-6/3/12 V | +-1.5/+-6/3/12 V | +-1.5/+-6/3/12 V | +-1.5/+-6/3/12 V |
认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 6 V | 6 V | - | - | 6 V | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | 1.5 V | 1.5 V | - | - | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | - | - | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | - | - | NO | NO | NO | NO |
最长断开时间 | 180 ns | 130 ns | - | - | 130 ns | 130 ns | 180 ns | 180 ns |
最长接通时间 | 110 ns | 240 ns | - | - | 240 ns | 240 ns | 110 ns | 110 ns |
切换 | MAKE-BEFORE-BREAK | BREAK-BEFORE-MAKE | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK |
技术 | CMOS | CMOS | - | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | - | - | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | DUAL | - | - | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Base Number Matches | 1 | 1 | - | - | 1 | 1 | 1 | 1 |
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