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2-799387-4 Product Details
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PGA Sockets
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2-799387-4
T E I nternal N umber: 2 - 7 9 9 3 8 7 - 4
Product Highlights:
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Very Low Insertion Force
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479 Positions
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PC B Mount Style = Through Hole
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Grid Size = 26x26
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Grid Spacing = 1.27 x 1.27 mm
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Documentation & Additional Information
Product Drawings:
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None Available
Catalog Pages/Data Sheets:
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None Available
Product Specifications:
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None Available
Application Specifications:
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None Available
Instruction Sheets:
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None Available
CAD Files:
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None Available
Additional Information:
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Product Line Information
Related Products:
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Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
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Insertion Force
= Very Low
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Number of Positions
= 479
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PC B Mount Style = Through Hole
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Grid Size
= 26x26
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Grid Spacing (mm [in])
= 1.27 x 1.27 [.050 x .050]
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C hip C ompatibility
= Intel? Pentium? 3 MOBILE (mPGA478A pattern),
Intel? Pentium? 4 (mPGA478B pattern), Intel? Pentium? 4 Processor
-M MOBILE (mPGA478B pattern), Intel? Pentium? M MOBILE
(mPGA478C pattern)
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Frame Style
= Open
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Sleeve Material = Brass
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Heat Sink Attachment
= Without
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Profile
= Low
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Board Standoff = Without
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Leg Style = Standard
Termination Related Features:
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Termination Post Length (mm [in])
= 2.29 [0.090]
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Socket Identifier = None
Body Related Features:
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Assembly Process Feature = None
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Socket Overall Height (mm [in]) = 3.4 [0.134]
Contact Related Features:
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C ontact Style
= Stamped + Formed
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C ontact Base Material
= Beryllium C opper
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C ontact Plating, Mating Area, Material = Gold (30)
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Sleeve Plating = Gold (30) over Nickel
Housing Related Features:
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Housing C olor = Black
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Housing Material = Epoxy GF
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Housing Flammability Rating = UL 94V-0
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Housing Material Temperature = High
Industry Standards:
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RoHS/ELV C ompliance
= Not reviewed for ELV/RoHS compliance
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Lead Free Solder Processes
= Not reviewed for lead free solder
process
Operation/Application:
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Application
= Production
Packaging Related Features:
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Packaging Method = Tube
Other:
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Brand = AMP
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