D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CQCC20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 包装说明 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | S-XQCC-N20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大I（ol） | 0.014 A |
| 功能数量 | 8 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 触发器类型 | POSITIVE EDGE |
| IDT54AHCT273LB | 5962-01-292-1662 | 74AHCT273D | IDT54AHCT273DB | IDT54AHCT273EB | 5962-01-292-8288 | |
|---|---|---|---|---|---|---|
| 描述 | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CQCC20 | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CQCC20 | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20 | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20 | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDFP20 | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | S-XQCC-N20 | S-XQCC-N20 | R-XDIP-T20 | R-XDIP-T20 | R-XDFP-F20 | R-XDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 最大I（ol） | 0.014 A | 0.014 A | 0.024 A | 0.014 A | 0.014 A | 0.014 A |
| 功能数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | QCCN | QCCN | DIP | DIP | DFP | DIP |
| 封装等效代码 | LCC20,.35SQ | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | FL20,.3 | DIP20,.3 |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK | IN-LINE |
| 峰值回流温度（摄氏度） | 225 | 225 | 260 | 225 | 260 | 225 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD |
| 端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 6 | 30 | 6 | 30 |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - |
| 包装说明 | QCCN, LCC20,.35SQ | - | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | - |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
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