AHC/VHC SERIES, HEX 1-INPUT INVERT GATE, PDSO14, LEAD FREE, EIAJ, SOP-14
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | SOIC |
| 包装说明 | LEAD FREE, EIAJ, SOP-14 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 系列 | AHC/VHC |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e4 |
| 长度 | 10.2 mm |
| 逻辑集成电路类型 | INVERTER |
| 湿度敏感等级 | NOT SPECIFIED |
| 功能数量 | 6 |
| 输入次数 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 13 ns |
| 认证状态 | COMMERCIAL |
| 座面最大高度 | 2.05 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 5.275 mm |
| MC74VHCU04MELG | MC74VHCU04DR2G | MC74VHCU04DR2 | MC74VHCU04DTR2G | MC74VHCU04DTR2 | |
|---|---|---|---|---|---|
| 描述 | AHC/VHC SERIES, HEX 1-INPUT INVERT GATE, PDSO14, LEAD FREE, EIAJ, SOP-14 | AHC/VHC SERIES, HEX 1-INPUT INVERT GATE, PDSO14, LEAD FREE, SOIC-14 | AHC/VHC SERIES, HEX 1-INPUT INVERT GATE, PDSO14, SOIC-14 | AHC/VHC SERIES, HEX 1-INPUT INVERT GATE, PDSO14, LEAD FREE, TSSOP-14 | AHC/VHC SERIES, HEX 1-INPUT INVERT GATE, PDSO14, LEAD FREE, TSSOP-14 |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 |
| 零件包装代码 | SOIC | SOIC | SOIC | TSSOP | TSSOP |
| 包装说明 | LEAD FREE, EIAJ, SOP-14 | LEAD FREE, SOIC-14 | SOIC-14 | LEAD FREE, TSSOP-14 | LEAD FREE, TSSOP-14 |
| 针数 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 系列 | AHC/VHC | AHC/VHC | AHC/VHC | AHC/VHC | AHC/VHC |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609代码 | e4 | e3 | e0 | e4 | e4 |
| 长度 | 10.2 mm | 8.65 mm | 8.65 mm | 5 mm | 5 mm |
| 逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
| 湿度敏感等级 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 功能数量 | 6 | 6 | 6 | 6 | 6 |
| 输入次数 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | TSSOP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 240 | 260 | 260 |
| 传播延迟（tpd） | 13 ns | 13 ns | 13 ns | 13 ns | 13 ns |
| 认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 座面最大高度 | 2.05 mm | 1.75 mm | 1.75 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD | MATTE TIN | TIN LEAD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 30 | 40 | 40 |
| 宽度 | 5.275 mm | 3.9 mm | 3.9 mm | 4.4 mm | 4.4 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 |
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